SCHEMBL2689461

SCHEMBL2689461

FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C1(C(F)(F)F)OC1(F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10325523 0.83
SCHEMBL8610654 0.80
SCHEMBL31225049 0.77
SCHEMBL1463856 0.77
SCHEMBL3078572 0.74 LMNA (0.31)
SCHEMBL691829 0.74 LMNA (0.31)
SCHEMBL20494686 0.74 LMNA (0.31)
SCHEMBL8607849 0.70
SCHEMBL8612548 0.70
SCHEMBL1444058 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8936744-B2 Photocurable resin composition containing fluorine and method for producing a resin mold using same DONGJIN SEMICHEM CO., LTD. (KR) 2015-01-20 US claimed
US-20120114906-A1 PHOTOCURABLE RESIN COMPOSITION CONTAINING FLUORINE AND METHOD FOR PRODUCING A RESIN MOLD USING SAME DONGJIN SEMICHEM CO., LTD (KR) 2012-05-10 US claimed
US-20250297145-A1 SURFACE TOLERANT ADHESIVE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC 2025-09-25 US disclosed
EP-4486841-A2 SURFACE TOLERANT ADHESIVE Huntsman Advanced Materials Americas LLC (US) 2025-01-08 EP disclosed
WO-2023183119-A9 SURFACE TOLERANT ADHESIVE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2023-11-16 WO disclosed
WO-2023183119-A2 SURFACE TOLERANT ADHESIVE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2023-09-28 WO disclosed
US-8936744-B2 Photocurable resin composition containing fluorine and method for producing a resin mold using same DONGJIN SEMICHEM CO., LTD. (KR) 2015-01-20 US disclosed
US-20120114906-A1 PHOTOCURABLE RESIN COMPOSITION CONTAINING FLUORINE AND METHOD FOR PRODUCING A RESIN MOLD USING SAME DONGJIN SEMICHEM CO., LTD (KR) 2012-05-10 US disclosed