⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Boric Acid SCHEMBL2693454 | 0.94 | — | — | |
| Boric Acid SCHEMBL2693619 | 0.94 | — | — | |
| Boric Acid SCHEMBL2693458 | 0.88 | — | — | |
| Boric Acid SCHEMBL2691797 | 0.88 | — | — | |
| Boric Acid SCHEMBL637769 | 0.87 | — | — | |
| Boric Acid SCHEMBL28964469 | 0.87 | — | — | |
| Boric Acid SCHEMBL2693439 | 0.87 | — | — | |
| Boric Acid SCHEMBL10946263 | 0.87 | — | — | |
| Boric Acid SCHEMBL1859857 | 0.87 | LMNA (0.67) | — | |
| Boric Acid SCHEMBL27467078 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12168747-B2 | Aerogel compositions for high temperature applications | ASPEN AEROGELS, INC. (US) | 2024-12-17 | — | — | US | disclosed |
| US-20240360363-A1 | AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | ASPEN AEROGELS, INC. | 2024-10-31 | — | — | US | disclosed |
| US-11634641-B2 | Aerogel compositions for high temperature applications | ASPEN AEROGELS, INC. (US) | 2023-04-25 | — | — | US | disclosed |
| US-11549059-B2 | Aerogel compositions with enhanced performance | MIDCAP FUNDING IV TRUST | 2023-01-10 | — | — | US | disclosed |
| US-11261380-B2 | Aerogel compositions for high temperature applications | MIDCAP FUNDING IV TRUST | 2022-03-01 | — | — | US | disclosed |
| US-20210207032-A1 | AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | ASPEN AEROGELS, INC. (US) | 2021-07-08 | — | — | US | disclosed |
| US-20210198578-A1 | AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | ASPEN AEROGELS, INC. (US) | 2021-07-01 | — | — | US | disclosed |
| US-20210079300-A1 | AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE | ASPEN AEROGELS, INC. (US) | 2021-03-18 | — | — | US | disclosed |
| US-20200061569-A1 | AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | ASPEN AEROGELS, INC. (US) | 2020-02-27 | — | — | US | disclosed |
| US-20160046867-A1 | AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE | MIDCAP FUNDING IV TRUST | 2016-02-18 | — | — | US | disclosed |
| US-9181486-B2 | Aerogel compositions with enhanced performance | ASPEN AEROGELS, INC. (US) | 2015-11-10 | — | — | US | disclosed |
| US-8168304-B2 | Micronized wood preservative formulations comprising boron compounds | OSMOSE, INC. (US) | 2012-05-01 | — | — | US | disclosed |
| US-20100183868-A1 | Micronized wood preservative formulations comprising boron compounds | OSMOSE UTILITIES SERVICES, INC. | 2010-07-22 | — | — | US | disclosed |
| WO-2007140293-A2 | AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE | ASPEN AEROGELS, INC. (US) | 2007-12-06 | — | — | WO | disclosed |
| US-20070272902-A1 | AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE | ASPEN AEROGELS, INC. (US) | 2007-11-29 | — | — | US | disclosed |
| WO-2007095610-A2 | MICRONIZED WOOD PRESERVATIVE FORMULATIONS COMPRISING BORON COMPOUNDS | OSMOSE, INC. (US) | 2007-08-23 | — | — | WO | disclosed |
| US-20060257578-A1 | Micronized wood preservative formulations comprising boron compounds | OSMOSE, INC. | 2006-11-16 | — | — | US | disclosed |