Boric Acid

Boric Acid

SCHEMBL2693455

OB(O)O.[Mn].[SbH3]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Boric Acid SCHEMBL2696059 0.93
Boric Acid SCHEMBL1006612 0.91
Boric Acid SCHEMBL21951856 0.91 LMNA (0.80)
Boric Acid SCHEMBL130711 0.91 LMNA (0.80)
Boric Acid SCHEMBL134000 0.91
Boric Acid SCHEMBL2693352 0.83
Boric Acid SCHEMBL5831413 0.83 LMNA (0.67)
Boric Acid SCHEMBL2693439 0.83
Boric Acid SCHEMBL4261978 0.83 LMNA (0.67)
Boric Acid SCHEMBL4261977 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12168747-B2 Aerogel compositions for high temperature applications ASPEN AEROGELS, INC. (US) 2024-12-17 US disclosed
US-20240360363-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. 2024-10-31 US disclosed
US-11634641-B2 Aerogel compositions for high temperature applications ASPEN AEROGELS, INC. (US) 2023-04-25 US disclosed
US-11549059-B2 Aerogel compositions with enhanced performance MIDCAP FUNDING IV TRUST 2023-01-10 US disclosed
US-11261380-B2 Aerogel compositions for high temperature applications MIDCAP FUNDING IV TRUST 2022-03-01 US disclosed
US-20210207032-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. (US) 2021-07-08 US disclosed
US-20210198578-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. (US) 2021-07-01 US disclosed
US-20210079300-A1 AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE ASPEN AEROGELS, INC. (US) 2021-03-18 US disclosed
US-20200061569-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. (US) 2020-02-27 US disclosed
US-20160046867-A1 AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE MIDCAP FUNDING IV TRUST 2016-02-18 US disclosed
US-9181486-B2 Aerogel compositions with enhanced performance ASPEN AEROGELS, INC. (US) 2015-11-10 US disclosed
US-8168304-B2 Micronized wood preservative formulations comprising boron compounds OSMOSE, INC. (US) 2012-05-01 US disclosed
US-20100183868-A1 Micronized wood preservative formulations comprising boron compounds OSMOSE UTILITIES SERVICES, INC. 2010-07-22 US disclosed
WO-2007140293-A2 AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE ASPEN AEROGELS, INC. (US) 2007-12-06 WO disclosed
US-20070272902-A1 AEROGEL COMPOSITIONS WITH ENHANCED PERFORMANCE ASPEN AEROGELS, INC. (US) 2007-11-29 US disclosed
WO-2007095610-A2 MICRONIZED WOOD PRESERVATIVE FORMULATIONS COMPRISING BORON COMPOUNDS OSMOSE, INC. (US) 2007-08-23 WO disclosed
US-20060257578-A1 Micronized wood preservative formulations comprising boron compounds OSMOSE, INC. 2006-11-16 US disclosed