SCHEMBL2701259

SCHEMBL2701259

Cc1cccc2cc3c[c]ccc3cc12

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 5/20 0.49
ALDH1A1 P00352 5/20 0.49
HSD17B10 Q99714 3/20 0.49
HPGD P15428 2/20 0.49
CYP2A6 P11509 4/20 0.44
HSD17B1 P14061 1/20 0.33
HSD17B2 P37059 1/20 0.33
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
KDM4E B2RXH2 2/20 0.33
GAA P10253 2/20 0.33
MEN1 O00255 2/20 0.30
MAPT P10636 2/20 0.30
KMT2A Q03164 2/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
USP2 O75604 1/20 0.30
POLB P06746 1/20 0.30
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2701310 1.00 CYP1A2 (0.49) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL28814502 0.81 ALDH1A1 (0.48) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL27980290 0.81 ALDH1A1 (0.48) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL130783 0.80 CYP1A2 (0.69) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL466417 0.79 CYP2A6 (0.54) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL385872 0.79 CYP2A6 (0.54) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL2251092 0.79 ALDH1A1 (0.41) CYP1A2ALDH1A1HSD17B10HPGDCYP3A4
SCHEMBL2258899 0.79 ALDH1A1 (0.41) CYP1A2ALDH1A1HSD17B10HPGDCYP3A4
SCHEMBL1309620 0.78 CYP1A2 (0.67) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6
SCHEMBL31498551 0.78 CYP1A2 (0.67) CYP1A2ALDH1A1HSD17B10HPGDCYP2A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3064997-B1 LAMINATE AND USE OF A KIT FOR MANUFACTURING OF A LAMINATE FUJIFILM CORP (JP) 2021-04-28 EP disclosed
US-10833272-B2 Laminate and kit FUJIFILM CORPORATION (JP) 2020-11-10 US disclosed
US-10439139-B2 2019-10-08 US disclosed
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 US disclosed
US-20180040824-A1 LAMINATE AND KIT FUJIFILM CORPORATION (JP) 2018-02-08 US disclosed
US-9746771-B2 Laminate body FUJIFILM CORPORATION (JP) 2017-08-29 US disclosed
EP-3064997-A1 LAMINATE, ORGANIC-SEMICONDUCTOR MANUFACTURING KIT, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR Fujifilm Corporation (JP) 2016-09-07 EP disclosed
US-20160240816-A1 LAMINATE, KIT FOR MANUFACTURING ORGANIC SEMICONDUCTOR, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2016-08-18 US disclosed
EP-3037880-A1 LAMINATE BODY Fujifilm Corporation (JP) 2016-06-29 EP disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 US disclosed
CN-102759859-A Method for making resin composition, hardening composition, and resin pattern, hardening composition, and optical component FUJIFILM CORP 2012-10-31 CN disclosed
CN-102725693-A Photosensitive resin composition, cured film, method for forming cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2012-10-10 CN disclosed
CN-102725692-A Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2012-10-10 CN disclosed
US-20120231396-A1 RESIN PATTERN, METHOD FOR PRODUCING THE PATTERN, METHOD FOR PRODUCING MEMS STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING PLATED PATTERN FUJIFILM CORPORATION (JP) 2012-09-13 US disclosed
EP-2498133-A2 Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern Fujifilm Corporation (JP) 2012-09-12 EP disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
EP-2447773-A1 Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus Fujifilm Corporation (JP) 2012-05-02 EP disclosed
CN-102193316-A Positive photosensitive resin composition, formation method of curing film, curing film, organic el display device and liquid crystal display device FUJI PHOTO FILM CO LTD 2011-09-21 CN disclosed
US-20060293503-A1 Polyaminopyridines and method for producing same SUMITOMO SEIKA CHEMICALS CO., LTD (JP) 2006-12-28 US disclosed
EP-1669390-A1 POLYAMINOPYRIDINES AND METHOD FOR PRODUCING SAME SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2006-06-14 EP disclosed