SCHEMBL2701987

SCHEMBL2701987

Cc1ccc2cc3cc[c]cc3cc2c1

nearest known ligand 0.54

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 6/20 0.54
CYP2A6 P11509 5/20 0.54
TDP1 Q9NUW8 1/20 0.46
ALDH1A1 P00352 4/20 0.34
NCK1 P16333 1/20 0.34
BACE1 P56817 1/20 0.34
KDM4E B2RXH2 1/20 0.34
LMNA P02545 1/20 0.34
GAA P10253 1/20 0.34
HPGD P15428 1/20 0.34
HSD17B10 Q99714 1/20 0.34
CA12 O43570 3/20 0.33
CA9 Q16790 3/20 0.33
MAPT P10636 1/20 0.32
RXFP1 Q9HBX9 1/20 0.32
PTPN1 P18031 1/20 0.32
CCR1 P32246 1/20 0.30
CCR5 P51681 1/20 0.30
CCR8 P51685 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2701718 1.00 CYP1A2 (0.54) CYP1A2CYP2A6TDP1ALDH1A1NCK1
SCHEMBL645484 0.91 CYP1A2 (0.59) CYP1A2CYP2A6TDP1ALDH1A1NCK1
SCHEMBL645286 0.91 CYP1A2 (0.56) CYP1A2CYP2A6TDP1ALDH1A1NCK1
SCHEMBL1413199 0.84
SCHEMBL3241439 0.84
SCHEMBL3241848 0.84
SCHEMBL1044899 0.84
SCHEMBL559813 0.82
SCHEMBL70257 0.82
SCHEMBL2463834 0.79 CYP1A2 (0.87) CYP1A2CYP2A6TDP1ALDH1A1NCK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3064997-B1 LAMINATE AND USE OF A KIT FOR MANUFACTURING OF A LAMINATE FUJIFILM CORP (JP) 2021-04-28 EP disclosed
US-10833272-B2 Laminate and kit FUJIFILM CORPORATION (JP) 2020-11-10 US disclosed
CN-105683835-B Laminated body, organic semiconductor manufacture are manufactured with set group and organic semiconductor uses light resistance composition 富士胶片株式会社 2019-11-26 CN disclosed
US-10439139-B2 2019-10-08 US disclosed
CN-105474099-B Laminated body 富士胶片株式会社 2019-09-03 CN disclosed
CN-103091986-B Positive-type photosensitive resin composition, cured film and forming method thereof, liquid crystal display device and organic electroluminescence display device and method of manufacturing same 富士胶片株式会社 2018-05-18 CN disclosed
CN-102955361-B Positive-type photosensitive resin composition, the forming method of cured film, cured film, liquid crystal display device and organic EL display 富士胶片株式会社 2018-04-06 CN disclosed
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 US disclosed
US-20180040824-A1 LAMINATE AND KIT FUJIFILM CORPORATION (JP) 2018-02-08 US disclosed
CN-102759859-B Resin combination, the manufacture method of hardening thing, resin pattern manufacture method, hardening thing and optical component 富士胶片株式会社 2017-10-24 CN disclosed
CN-102759859-A Method for making resin composition, hardening composition, and resin pattern, hardening composition, and optical component FUJIFILM CORP 2012-10-31 CN disclosed
CN-102725693-A Photosensitive resin composition, cured film, method for forming cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2012-10-10 CN disclosed
CN-102725692-A Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2012-10-10 CN disclosed
US-20120231396-A1 RESIN PATTERN, METHOD FOR PRODUCING THE PATTERN, METHOD FOR PRODUCING MEMS STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING PLATED PATTERN FUJIFILM CORPORATION (JP) 2012-09-13 US disclosed
EP-2498133-A2 Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern Fujifilm Corporation (JP) 2012-09-12 EP disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
EP-2447773-A1 Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus Fujifilm Corporation (JP) 2012-05-02 EP disclosed
CN-102193316-A Positive photosensitive resin composition, formation method of curing film, curing film, organic el display device and liquid crystal display device FUJI PHOTO FILM CO LTD 2011-09-21 CN disclosed
US-20060293503-A1 Polyaminopyridines and method for producing same SUMITOMO SEIKA CHEMICALS CO., LTD (JP) 2006-12-28 US disclosed
EP-1669390-A1 POLYAMINOPYRIDINES AND METHOD FOR PRODUCING SAME SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2006-06-14 EP disclosed