SCHEMBL27199205

SCHEMBL27199205

C=CC(=O)O[SbH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL419299 0.72 TSHR (0.46)
SCHEMBL278164 0.72
Sulfur Dioxide SCHEMBL27747789 0.71 TSHR (0.40)
SCHEMBL17035614 0.71 TSHR (0.40)
SCHEMBL15068262 0.71 TSHR (0.40)
SCHEMBL5071464 0.69 TSHR (0.43)
SCHEMBL83524 0.69
SCHEMBL5029222 0.69
SCHEMBL221290 0.69
SCHEMBL31325799 0.69 TSHR (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024000383-A1 METHOD FOR REPAIRING ACRYLATE POLYMER MATERIAL 广州工程技术职业学院 2024-01-04 WO claimed
CN-114940775-B Method for repairing acrylate polymer material 广州工程技术职业学院 2023-05-26 CN claimed
US-20240128082-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-04-18 US disclosed
WO-2024000383-A1 METHOD FOR REPAIRING ACRYLATE POLYMER MATERIAL 广州工程技术职业学院 2024-01-04 WO disclosed
CN-114940775-B Method for repairing acrylate polymer material 广州工程技术职业学院 2023-05-26 CN disclosed