SCHEMBL27202077

SCHEMBL27202077

CSc1ccc(C(C(C)C=O)N2CCOCC2)cc1

nearest known ligand 0.56

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.56
TSHR P16473 4/20 0.56
HTT P42858 2/20 0.56
CYP3A4 P08684 2/20 0.45
CYP2C19 P33261 1/20 0.45
HIF1A Q16665 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
MAPK1 P28482 2/20 0.41
LMNA P02545 2/20 0.40
HPGD P15428 1/20 0.37
FKBP1A P62942 1/20 0.37
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
AVPR1A P37288 2/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
KDM4E B2RXH2 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20335165 0.84 ALDH1A1 (0.46) ALDH1A1TSHRHTTCYP3A4CYP2C19
SCHEMBL6060456 0.84 ALDH1A1 (0.55) ALDH1A1TSHRHTTCYP3A4CYP2C19
SCHEMBL22660960 0.75 ALDH1A1 (0.45) ALDH1A1TSHRHTTSMN1; SMN2MAPK1
SCHEMBL1980889 0.75 ALDH1A1 (0.46) ALDH1A1TSHRHTTCYP3A4CYP2C19
SCHEMBL1696906 0.72 SLC6A4 (0.46) ALDH1A1TSHRHTTSMN1; SMN2MAPK1
SCHEMBL28534307 0.72 ALDH1A1 (0.53) ALDH1A1TSHRHTTCYP3A4HIF1A
SCHEMBL20570594 0.72 SLC6A4 (0.46) ALDH1A1TSHRHTTSMN1; SMN2MAPK1
SCHEMBL28210928 0.71 ALDH1A1 (0.45) ALDH1A1TSHRHTTSMN1; SMN2MAPK1
SCHEMBL29112611 0.71 SMN1; SMN2 (0.41) ALDH1A1TSHRHTTSMN1; SMN2MAPK1
SCHEMBL21439244 0.70 CYP1A2 (0.47) ALDH1A1TSHRCYP3A4CYP2C19SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240134277-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2024-04-25 US disclosed
CN-117836717-A Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board 株式会社力森诺科 2024-04-05 CN disclosed
CN-116868123-A Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board 株式会社力森诺科 2023-10-10 CN disclosed