Acetic Acid

Acetic Acid

SCHEMBL27243

CC(=O)O.CC(O)CC(C)O

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 1/20 0.47
LCK P06239 1/20 0.47
FYN P06241 1/20 0.47
TP53 P04637 1/20 0.44
TDP1 Q9NUW8 2/20 0.39
TSHR P16473 2/20 0.39
ALDH1A1 P00352 3/20 0.38
RNPEP Q9H4A4 1/20 0.38
SLC7A5 Q01650 1/20 0.38
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL15411238 0.90 TP53 (0.47) TP53TDP1TSHRALDH1A1RNPEP
Acetic Acid SCHEMBL1133178 0.88 RNPEP (0.46) FFAR3LCKFYNTP53TDP1
Methacrylic Acid SCHEMBL9779496 0.83 TSHR (0.38) TP53TDP1TSHRALDH1A1RNPEP
Methacrylic Acid SCHEMBL2544208 0.83 TSHR (0.38) TP53TDP1TSHRALDH1A1RNPEP
SCHEMBL12559536 0.82
SCHEMBL37585 0.82
SCHEMBL42873 0.82
SCHEMBL840436 0.82
SCHEMBL42294 0.82
SCHEMBL524531 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 233 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12153345-B2 Photosensitive resin composition SUMITOMO BAKELITE CO., LTD. (JP) 2024-11-26 US claimed
US-20240045326-A1 PHOTOSENSITIVE RESIN COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2024-02-08 US claimed
CN-109313388-B Negative photosensitive composition 住友电木株式会社 2022-06-21 CN claimed
WO-2022118853-A1 THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-06-09 WO claimed
US-9176381-B2 Positive type photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2015-11-03 US claimed
US-20150160553-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film, and Display Device Using the Same CHEIL INDUSTRIES INC. (KR) 2015-06-11 US claimed
US-8703367-B2 Positive photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2014-04-22 US claimed
US-8568954-B2 Positive photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2013-10-29 US claimed
US-20110171578-A1 Positive Photosensitive Resin Composition CHEIL INDUSTRIES INC. (KR) 2011-07-14 US claimed
US-20110003248-A1 Positive photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2011-01-06 US claimed
WO-2010035925-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CHEIL INDUSTRIES INC. (KR) 2010-04-01 WO claimed
WO-2009116724-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CHEIL INDUSTRIES INC. (KR) 2009-09-24 WO claimed
US-20250138422-A1 PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2025-05-01 US disclosed
US-12153345-B2 Photosensitive resin composition SUMITOMO BAKELITE CO., LTD. (JP) 2024-11-26 US disclosed
US-20240321803-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-09-26 US disclosed
US-20240272551-A1 NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-08-15 US disclosed
US-6048924-A AMINO RESIN FROM CARBOXY AMINO COMPOUND BENZOGUANIMINE DAINIPPON INK AND CHEMICALS, INC. (JP) 2000-04-11 US disclosed
EP-0990673-A2 Polybenzoxazole resin and precursor thereof SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-04-05 EP disclosed
EP-0860473-A1 AQUEOUS RESIN COMPOSITION AND AQUEOUS PAINT DAINIPPON INK AND CHEMICALS, INC. (JP) 1998-08-26 EP disclosed
EP-0807852-A1 Positive type photosensitive resin composition and semiconductor device using the same SUMITOMO BAKELITE COMPANY LIMITED (JP) 1997-11-19 EP disclosed