SCHEMBL272886

SCHEMBL272886

Nc1cc(C(F)(F)F)cc(N)n1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NOS3 P29474 2/20 0.54
NOS2 P35228 2/20 0.54
BACE1 P56817 2/20 0.47
TSHR P16473 1/20 0.41
MAPK1 P28482 1/20 0.41
MAPT P10636 2/20 0.40
KDM4E B2RXH2 1/20 0.40
LMNA P02545 1/20 0.40
EPHX2 P34913 1/20 0.39
SCN4A P35499 1/20 0.39
CA2 P00918 1/20 0.39
CHKA P35790 1/20 0.39
PTPN5 P54829 1/20 0.39
MET P08581 1/20 0.39
IDH2 P48735 2/20 0.38
IDO1 P14902 1/20 0.38
NOS1 P29475 1/20 0.38
IKBKB O14920 1/20 0.37
ALDH1A1 P00352 1/20 0.37
GAA P10253 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17923118 0.85 NOS3 (0.47) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL2479769 0.85 NOS3 (0.47) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL1972458 0.84 NOS3 (0.52) NOS3NOS2BACE1IDH2NOS1
SCHEMBL29560454 0.84 NOS3 (0.45) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL18555170 0.84 NOS3 (0.45) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL24597143 0.84 NOS3 (0.45) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL29899418 0.84 NOS3 (0.52) NOS3NOS2BACE1IDH2NOS1
SCHEMBL29544677 0.84 NOS3 (0.45) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL2087532 0.84 NOS3 (0.45) NOS3NOS2BACE1TSHRMAPK1
SCHEMBL23344931 0.80 NOS3 (0.42) NOS3NOS2BACE1MAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 163 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116922004-A Manufacturing method of non-stick pan with wear-resistant antibacterial coating 宁波市金象厨具有限公司 2023-10-24 CN claimed
EP-1579272-A4 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS FUJIFILM ELECTRONIC MATERIALS (US) 2008-12-17 EP claimed
US-7416830-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-26 US claimed
EP-1680711-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS Fujifilm Electronic Materials USA, Inc. (US) 2006-07-19 EP claimed
US-7018776-B2 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. (US) 2006-03-28 US claimed
US-20060063095-A9 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2006-03-23 US claimed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP claimed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP claimed
US-20050181297-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2005-08-18 US claimed
WO-2005038524-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2005-04-28 WO claimed
US-20040161711-A1 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
US-20040161619-A1 Process for producing a heat resistant relief structure ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
US-5218083-A Polyimides prepared from 3,5-diaminobenzotrifluoride THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 1993-06-08 US claimed
US-5104946-A For heat resistant low dielectric coatings OCCIDENTAL CHEMICAL CORPORATION (US) 1992-04-14 US claimed
EP-0438751-A2 Solutions of polyimidesiloxanes in butyrolactone OCCIDENTAL CHEMICAL CORPORATION (US) 1991-07-31 EP claimed
JP-5345822-A None JP disclosed
US-4957993-A SEMICONDUCTOR MANUFACTURE, WIRE AND CABLE COATING, FILMS, FIBERS, MOLDING, EXTRUSION OCCIDENTAL CHEMICAL CORPORATION (US) 1990-09-18 US disclosed
EP-0371313-A2 Polyimide siloxanes and methods for their preparation and use OCCIDENTAL CHEMICAL CORPORATION (US) 1990-06-06 EP disclosed