⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7513633 | 0.79 | — | — | |
| SCHEMBL21641959 | 0.78 | — | — | |
| SCHEMBL5493393 | 0.77 | — | — | |
| SCHEMBL29170565 | 0.77 | — | — | |
| SCHEMBL29170578 | 0.77 | — | — | |
| SCHEMBL21641952 | 0.77 | — | — | |
| SCHEMBL2030791 | 0.71 | — | — | |
| SCHEMBL19064352 | 0.68 | — | — | |
| SCHEMBL4280949 | 0.68 | — | — | |
| SCHEMBL27980324 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7018776-B2 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-03-28 | — | — | US | claimed |
| US-20040161711-A1 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | claimed |
| JP-5140306-A | — | — | None | — | — | JP | disclosed |
| JP-5311072-A | — | — | None | — | — | JP | disclosed |
| US-9519216-B2 | Positive photosensitive resin compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2016-12-13 | — | — | US | disclosed |
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-20110124772-A1 | ANTIMICROBIAL POLYMERS AND THEIR USES | DSM IP ASSETS B.V. (NL) | 2011-05-26 | — | — | US | disclosed |
| US-7803510-B2 | Positive photosensitive polybenzoxazole precursor compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-09-28 | — | — | US | disclosed |
| US-20090197067-A1 | Novel Positive Photosensitive Resin Compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-08-06 | — | — | US | disclosed |
| EP-1266266-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-12-18 | — | — | EP | disclosed |
| EP-1171802-A4 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPEC CHEM INC (US) | 2002-03-13 | — | — | EP | disclosed |
| EP-1171802-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | Arch Specialty Chemicals, Inc. (US) | 2002-01-16 | — | — | EP | disclosed |
| WO-2001073509-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-10-04 | — | — | WO | disclosed |
| US-6177225-B1 | COMPRISING A CAPPED POLYBENZOXAZOLE PRECURSOR POLYMER, A PHOTOSENSITIVE AGENT, AND A SOLVENT | ARCH SPECIALTY CHEMICALS, INC. | 2001-01-23 | — | — | US | disclosed |
| WO-2000019275-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-04-06 | — | — | WO | disclosed |
| US-5834581-A | Process for making polyimide-polyamic ester copolymers | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1998-11-10 | — | — | US | disclosed |
| JP-H05311072-A | POLYIMIDE RESIN COMPOSITION OF HIGH ADHESION | SUMITOMO BAKELITE CO LTD | 1993-11-22 | — | — | JP | disclosed |
| JP-H05140306-A | PRODUCTION OF PARTIALLY IMIDATED POLYAMIC ACID COMPOSITION | SUMITOMO BAKELITE CO LTD | 1993-06-08 | — | — | JP | disclosed |