SCHEMBL5493393

SCHEMBL5493393

CC1(CCCN)C[Si](C)(CCCN)[Si](C)(C)[Si](C)(C)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL272918 0.77
SCHEMBL21641950 0.77
SCHEMBL21641955 0.75
SCHEMBL28916774 0.75
SCHEMBL27167203 0.70
SCHEMBL28916754 0.66
SCHEMBL5792942 0.66
SCHEMBL3099423 0.66
SCHEMBL21641947 0.65
SCHEMBL21641959 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024247513-A1 POROUS MOLDED BODY AND GAS ADSORBENT AGC株式会社 2024-12-05 WO disclosed
WO-2024085046-A1 CARBON DIOXIDE ADSORBENT AGC株式会社 2024-04-25 WO disclosed
US-9890183-B2 Aminosilicone solvent recovery methods and systems GENERAL ELECTRIC COMPANY (US) 2018-02-13 US disclosed
US-20170158717-A1 AMINOSILICONE SOLVENT RECOVERY METHODS AND SYSTEMS GENERAL ELECTRIC COMPANY (US) 2017-06-08 US disclosed
US-20130052109-A1 COMPOSITIONS FOR ABSORBING CARBON DIOXIDE, AND RELATED PROCESSES AND SYSTEMS GENERAL ELECTRIC COMPANY (US) 2013-02-28 US disclosed
WO-2013028391-A1 COMPOSITIONS FOR ABSORBING CARBON DIOXIDE, AND RELATED PROCESSES AND SYSTEMS GENERAL ELECTRIC COMPANY (US) 2013-02-28 WO disclosed
US-7194956-B2 Offset printing method and printing apparatus using heat and light to make a printing plate hydrophilic and hydrophobic FUJI PHOTO FILM CO., LTD. (JP) 2007-03-27 US disclosed
EP-1302313-B1 Lithographic printing plate precursor FUJI PHOTO FILM CO LTD (JP) 2006-12-13 EP disclosed
US-20060156941-A1 Planographic printing method, original printing plate and printing press FUJI PHOTO FILM CO., LTD. 2006-07-20 US disclosed
US-7032514-B2 Planographic printing method, original printing plate and printing press FUJI PHOTO FILM CO., LTD. (JP) 2006-04-25 US disclosed
US-6892640-B2 Offset printing method and printing apparatus using the same FUJI PHOTO FILM CO., LTD. (JP) 2005-05-17 US disclosed
US-20050028698-A1 Offset printing method and printing apparatus using the same FUJI PHOTO FILM CO., LTD. 2005-02-10 US disclosed
US-6852469-B2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2005-02-08 US disclosed
US-6833225-B2 Lithographic printing method and lithographic printing apparatus thereof FUJI PHOTO FILM CO., LTD. (JP) 2004-12-21 US disclosed
US-6694880-B1 USING MATERIAL BEING HYDROPHILIC AT ONE TEMPERATURE AND HYDROPHOBIC AT ANOTHER FUJI PHOTO FILM CO., LTD. (JP) 2004-02-24 US disclosed
US-20030113666-A1 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. 2003-06-19 US disclosed
EP-1302313-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2003-04-16 EP disclosed
US-20020121206-A1 Lithographic printing method and lithographic printing apparatus thereof FUJI PHOTO FILM CO., LTD. 2002-09-05 US disclosed
US-20020001776-A1 Planographic printing method, original printing plate and printing press FUJI PHOTO FILM CO., LTD. 2002-01-03 US disclosed