SCHEMBL2730449

SCHEMBL2730449

Cn1c(=O)n(CCO)c(=O)n(CCO)c1=O

nearest known ligand 0.49

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ PDE4A P27815 4/20 0.41
▸ PDE4B Q07343 4/20 0.41
▸ PDE4C Q08493 4/20 0.41
▸ PDE4D Q08499 4/20 0.41
▸ HTT P42858 1/20 0.38
▸ HSD17B10 Q99714 1/20 0.38
▸ LMNA P02545 3/20 0.37
▸ ALDH1A1 P00352 2/20 0.37
▸ ADORA2B P29275 1/20 0.35
▸ KMT2A Q03164 2/20 0.34
▸ KDM4E B2RXH2 1/20 0.34
▸ MEN1 O00255 1/20 0.34
▸ THRB P10828 1/20 0.32
▸ TSHR P16473 1/20 0.32
▸ MAPK1 P28482 1/20 0.32
▸ ADORA2A P29274 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2614957 0.95 HTT (0.42) PDE4APDE4BPDE4CPDE4DHTT
SCHEMBL35878 0.89 PDE4A (0.39) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL12034462 0.86 HTT (0.34) PDE4APDE4BPDE4CPDE4DHTT
SCHEMBL839061 0.85 APEX1 (0.53) PDE4APDE4BPDE4CPDE4DALDH1A1
Formaldehyde SCHEMBL8709282 0.83 CYP3A4 (0.38) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL13917311 0.82 PDE4A (0.53) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL29195195 0.82 GSK3B (0.41) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL838751 0.82 GSK3B (0.41) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL20738815 0.82 PDE4A (0.53) PDE4APDE4BPDE4CPDE4DHSD17B10
Acetic Acid SCHEMBL30567453 0.82 APEX1 (0.39) PDE4APDE4BPDE4CPDE4DHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3093320-B1 COATING COMPOSITION FOR PACKAGING ARTICLES SWIMC LLC (US) 2021-07-21 — — EP disclosed
US-10712662-B2 Methods of forming patterns using compositions for an underlayer of photoresist SAMSUNG ELECTRONICS CO., LTD. (KR) 2020-07-14 — — US disclosed
US-20170199459-A1 METHODS OF FORMING PATTERNS USING COMPOSITIONS FOR AN UNDERLAYER OF PHOTORESIST DONGJIN SEMICHEM CO., LTD. (KR) 2017-07-13 — — US disclosed
US-20150062524-A1 DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2015-03-05 — — US disclosed
US-8293823-B2 moldings comprising phosphorus-containing, nitrogen-containing compounds, condensates or mixtures as flameproofing agents, polycarbonates, polyesters and adjuvants BASF SE (DE) 2012-10-23 — — US disclosed
JP-2011236175-A N-METHYL ISOCYANURATE COMPOUND SHIKOKU CHEM CORP 2011-11-24 — — JP disclosed
US-20080194741-A1 Flowable Thermoplastic Materials With Halogen-Free Flame Protection BASF AKTIENGESELLSCHAFT (DE) 2008-08-14 — — US disclosed
US-7169838-B2 Halogen-free flameproof polyester BASF AKTIENGESELLSCHAFT (DE) 2007-01-30 — — US disclosed
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