Formaldehyde

Formaldehyde

SCHEMBL8709282

C=O.O=c1n(CCO)c(=O)n(CCO)c(=O)n1CCO

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.38
PDE4A P27815 2/20 0.37
PDE4B Q07343 2/20 0.37
PDE4C Q08493 2/20 0.37
PDE4D Q08499 2/20 0.37
HSD17B10 Q99714 1/20 0.36
KMT2A Q03164 2/20 0.36
ALDH1A1 P00352 2/20 0.34
LMNA P02545 2/20 0.34
NPSR1 Q6W5P4 1/20 0.34
APEX1 P27695 1/20 0.33
KDM4E B2RXH2 2/20 0.32
MEN1 O00255 1/20 0.32
THRB P10828 1/20 0.31
TSHR P16473 1/20 0.31
MAPK1 P28482 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35878 0.94 PDE4A (0.39) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL21163108 0.86 PDE4A (0.36) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL30002999 0.86 PDE4A (0.36) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL15428923 0.83 PDE4A (0.35) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL13788796 0.83 PDE4A (0.40) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL2730449 0.83 PDE4A (0.41) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL9718199 0.82 HSD17B10 (0.36) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL13917311 0.81 PDE4A (0.53) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL20738815 0.81 PDE4A (0.53) CYP3A4PDE4APDE4BPDE4CPDE4D
SCHEMBL29195195 0.81 GSK3B (0.41) PDE4APDE4BPDE4CPDE4DHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5718996-A ELECTRIC CHARGE RETAINING LAYER CONSISTS OF INSULATING RESIN HAVING NO PHOTOCONDUCTIVE PROPERTIES AND HEAT RESISTANT INSULATING LAYER HAVING GLASS TRANSITION TEMPERATURE HIGHER THAN THAT OF THE RESIN LAYER DAI NIPPON PRINTING CO., LTD. (JP) 1998-02-17 US disclosed
US-5587264-A COMPRISING AN ELECTRODE LAYER AND AN ELECTRIC CHARGE RETAINING LAYER; IMPROVING LAYER ARRANGEMENT; IMPROVING LAMINATION METHOD DAI NIPPON PRINTING CO. LTD. (JP) 1996-12-24 US disclosed
EP-0592662-A1 ELECTROSTATIC DATA RECORDING MEDIUM AND ELECTROSTATIC DATA RECORDING/REPRODUCING METHOD DAI NIPPON PRINTING CO., LTD. (JP) 1994-04-20 EP disclosed