SCHEMBL27330641

SCHEMBL27330641

CO[Si](OC)(OC)C1=CCC=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11895614 0.79
SCHEMBL24595847 0.68
SCHEMBL5087374 0.65
SCHEMBL7068841 0.62
SCHEMBL17633901 0.60
SCHEMBL17633889 0.59
SCHEMBL27482617 0.59
SCHEMBL17633892 0.59
SCHEMBL5461456 0.58
SCHEMBL7188761 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111205815-B OLED sealant composition capable of being cured in UV hybrid mode 东莞市联灏新材料技术开发有限公司 2022-02-01 CN claimed
CN-107556964-B Radiation-curable quantum dot material sealant composition 东莞市联灏新材料技术开发有限公司 2021-01-26 CN claimed
CN-111205815-A OLED sealant composition capable of being cured in UV hybrid mode 东莞市联灏新材料技术开发有限公司 2020-05-29 CN claimed
CN-111171729-A UV LED fast curing OLED terminal protection adhesive 东莞市联灏新材料技术开发有限公司 2020-05-19 CN claimed
CN-111205815-B OLED sealant composition capable of being cured in UV hybrid mode 东莞市联灏新材料技术开发有限公司 2022-02-01 CN disclosed
CN-111171729-B UV LED fast curing OLED terminal protection adhesive 东莞市联灏新材料技术开发有限公司 2021-11-23 CN disclosed
CN-107556964-B Radiation-curable quantum dot material sealant composition 东莞市联灏新材料技术开发有限公司 2021-01-26 CN disclosed
CN-111205815-A OLED sealant composition capable of being cured in UV hybrid mode 东莞市联灏新材料技术开发有限公司 2020-05-29 CN disclosed
CN-111171729-A UV LED fast curing OLED terminal protection adhesive 东莞市联灏新材料技术开发有限公司 2020-05-19 CN disclosed
CN-102272207-B Polypropylene resin composition for microporous film formation MITSUI CHEMICALS INC 2013-06-05 CN disclosed
CN-102272208-B Polypropylene resin composition for forming microporous film PRIME POLYMER CO LTD 2013-04-10 CN disclosed
CN-102272207-A Polypropylene resin composition for microporous film formation 2011-12-07 CN disclosed
CN-102272208-A Polypropylene resin composition for forming microporous film 2011-12-07 CN disclosed
CN-1113904-C Olefin polymerization process MITSUI CHEMICALS INC (JP) 2003-07-09 CN disclosed
CN-1105120-C Polypropylene resin composition and use thereof GRAND POLYMER CO LTD (JP) 2003-04-09 CN disclosed
CN-1241196-A Polypropylene resin composition and use thereof GRAND POLYMER CO LTD (JP) 2000-01-12 CN disclosed
CN-1225369-A Olefin polymerization process MITSUI CHEMICALS INC (JP) 1999-08-11 CN disclosed
CN-1043233-C Olefin polymerization catalyst and use thereof MITSUI CHEMICAL CO LTD (JP) 1999-05-05 CN disclosed
CN-1040379-A Process for polymerization of olefins and catalyst for polymerization MITSUI PETROCHEMICAL IND (JP) 1990-03-14 CN disclosed