SCHEMBL27427640

SCHEMBL27427640

CC1(C)CCCOC1[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14980230 0.72
SCHEMBL4698567 0.70
SCHEMBL5679411 0.67
SCHEMBL12191535 0.67
SCHEMBL12220100 0.67
SCHEMBL12191547 0.67
SCHEMBL16085873 0.67 UGT2B7 (0.33)
SCHEMBL24323204 0.65 TRPA1 (0.30)
SCHEMBL1934917 0.63
SCHEMBL14553489 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102348485-A Methods for removing vicinal diols from lactic acid fermentation broth DOW CORNING 2012-02-08 CN disclosed
CN-1938833-B Techniques promoting adhesion of porous low k film to underlying barrier layer and interconnection structure APPLIED MATERIALS INC 2010-12-22 CN disclosed
CN-101389715-A Systems and methods for functionalizing particulates with silane-containing materials DOW CORNING (US) 2009-03-18 CN disclosed
CN-1957108-A Multi-stage curing method of low k nano-porous films APPLIED MATERIALS INC (US) 2007-05-02 CN disclosed
CN-1938833-A Techniques promoting adhesion of porous low k film to underlying barrier layer APPLIED MATERIALS INC (US) 2007-03-28 CN disclosed
CN-1113408-C Incorporation of low-K polymers into interlayer dielectrics using controlled electron beam radiation ALLIED SIGNAL INC (US) 2003-07-02 CN disclosed