SCHEMBL2742859

SCHEMBL2742859

COc1ccc2cc(C(=O)Oc3ccc(C(C)=O)cc3)ccc2c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.64
KDM4E B2RXH2 1/20 0.60
MEN1 O00255 2/20 0.55
TDP1 Q9NUW8 1/20 0.55
CASP3 P42574 1/20 0.55
SENP8 Q96LD8 1/20 0.55
SENP7 Q9BQF6 1/20 0.55
SENP6 Q9GZR1 1/20 0.55
CYP1A2 P05177 3/20 0.51
CYP2C19 P33261 2/20 0.51
HPGD P15428 2/20 0.51
ALDH1A1 P00352 1/20 0.51
HSD17B10 Q99714 1/20 0.51
HGFAC Q04756 1/20 0.50
CYP3A4 P08684 1/20 0.50
CYP11B1 P15538 1/20 0.50
CYP11B2 P19099 1/20 0.50
POLB P06746 1/20 0.49
MAPT P10636 4/20 0.49
GBA1 P04062 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14579680 0.94 KDM4E (0.60) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL12895853 0.94 KMT2A (0.64) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL14579671 0.92 KMT2A (0.61) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL14430924 0.92 KMT2A (0.57) KMT2AKDM4EMEN1CASP3SENP8
SCHEMBL14579682 0.91 KMT2A (0.63) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL14579673 0.89 KMT2A (0.58) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL14579672 0.89 KMT2A (0.58) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL14579668 0.89 KMT2A (0.60) KMT2AKDM4EMEN1TDP1CASP3
SCHEMBL12895866 0.88 MAPT (0.55) KMT2AMEN1TDP1HPGDALDH1A1
SCHEMBL15374827 0.88 LMNA (0.61) KMT2AKDM4EMEN1CASP3SENP8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230257515-A1 RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-08-17 US disclosed
US-20230257515-A1 RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-08-17 US disclosed
US-11680332-B2 Surface-treated copper foil, and copper-clad laminate and circuit board using same FURUKAWA ELECTRIC CO., LTD. (JP) 2023-06-20 US disclosed
US-9287533-B2 Non-aqueous secondary battery, mounted unit, and method for manufacturing non-aqueous secondary battery NEC CORPORATION (JP) 2016-03-15 US disclosed
US-20140087235-A1 NONAQUEOUS-SECONDARY-BATTERY LAYERED STRUCTURE AND NONAQUEOUS-SECONDARY-BATTERY LAYERING METHOD NEC CORPORATION (JP) 2014-03-27 US disclosed
US-20140079984-A1 NON-AQUEOUS SECONDARY BATTERY, MOUNTED UNIT, AND METHOD FOR MANUFACTURING NON-AQUEOUS SECONDARY BATTERY NEC CORPORATION (JP) 2014-03-20 US disclosed
US-20130209878-A1 NONAQUEOUS SECONDARY CELL AND METHOD OF MANUFACTURING THE SAME NEC CORPORATION (JP) 2013-08-15 US disclosed
US-20130033671-A1 LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (US) 2013-02-07 US disclosed
US-20120000527-A1 UNDERSIDE PROTECTIVE SHEET FOR SOLAR CELL, SOLAR CELL MODULE, AND GAS-BARRIER FILM SEKISUI CHEMICAL CO., LTD. (JP) 2012-01-05 US disclosed
US-20110315200-A1 UNDERSIDE PROTECTIVE SHEET FOR SOLAR CELL, SOLAR CELL MODULE, AND GAS-BARRIER FILM SEKISUI CHEMICAL CO., LTD. (JP) 2011-12-29 US disclosed
US-20110284317-A1 SPEAKER DIAPHRAGM, SPEAKER, AND PRODUCTION METHOD OF SPEAKER DIAPHRAGM MITSUBISHI ELECTRIC CORPORATION (JP) 2011-11-24 US disclosed
US-20090166070-A1 FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME LG ELECTRONICS INC. (KR) 2009-07-02 US disclosed
US-20090169773-A1 FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME LG ELECTRONICS INC. (REPRESENTATIVE: YONG NAM) (KR) 2009-07-02 US disclosed
US-20090167638-A1 FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME LG ELECTRONICS INC (KR) 2009-07-02 US disclosed