SCHEMBL27437481

SCHEMBL27437481

CCOC(=O)C(C)C(=O)OC1CCCC1

nearest known ligand 0.44

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.44
CYP19A1 P11511 1/20 0.43
NAAA Q02083 2/20 0.42
CYP2D6 P10635 1/20 0.41
ALDH1A1 P00352 3/20 0.40
L3MBTL1 Q9Y468 4/20 0.39
THRB P10828 1/20 0.39
ATM Q13315 1/20 0.39
CASP6 P55212 1/20 0.38
NPSR1 Q6W5P4 1/20 0.37
HTT P42858 1/20 0.37
TSHR P16473 1/20 0.36
KDM4E B2RXH2 1/20 0.36
POLB P06746 1/20 0.36
METAP2 P50579 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
SLC6A2 P23975 1/20 0.35
SLC6A4 P31645 1/20 0.35
SLC6A3 Q01959 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27874692 0.88 CYP19A1 (0.50) EPHX1CYP19A1NAAACYP2D6L3MBTL1
SCHEMBL8984845 0.86 CYP19A1 (0.53) EPHX1CYP19A1NAAAL3MBTL1HTT
SCHEMBL28814763 0.81 CYP19A1 (0.45) EPHX1CYP19A1NAAAL3MBTL1THRB
SCHEMBL27437355 0.81 CYP19A1 (0.47) EPHX1CYP19A1NAAAL3MBTL1HTT
SCHEMBL11712734 0.80 EPHX1 (0.43) EPHX1CYP19A1NAAACYP2D6ALDH1A1
SCHEMBL10963755 0.79 EPHX1 (0.46) EPHX1CYP19A1NAAACYP2D6ALDH1A1
SCHEMBL11878183 0.79 EPHX1 (0.46) EPHX1CYP19A1NAAACYP2D6ALDH1A1
SCHEMBL28967437 0.79 EPHX1 (0.46) EPHX1CYP19A1NAAACYP2D6ALDH1A1
SCHEMBL26939371 0.79 CYP19A1 (0.46) EPHX1CYP19A1NAAACYP2D6L3MBTL1
Hydrochloric Acid SCHEMBL11878173 0.77 EPHX1 (0.45) EPHX1CYP19A1NAAACYP2D6ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed