SCHEMBL2746848

SCHEMBL2746848

C#Cc1cc2ccccc2c(-c2cccc3ccccc23)c1C#Cc1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.36
PTPN22 Q9Y2R2 1/20 0.36
CHAT P28329 1/20 0.34
MCL1 Q07820 1/20 0.33
CES1 P23141 1/20 0.33
APP P05067 1/20 0.32
MEN1 O00255 1/20 0.32
MITF O75030 1/20 0.32
MAPT P10636 1/20 0.32
HTT P42858 1/20 0.32
RAD52 P43351 1/20 0.32
KMT2A Q03164 1/20 0.32
SOS1 Q07889 1/20 0.32
STK10 O94804 1/20 0.32
SLK Q9H2G2 1/20 0.32
DHFR P00374 1/20 0.31
CYP1A1 P04798 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP1B1 Q16678 1/20 0.31
FNTA P49354 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28573329 0.75 CHAT (0.43) GPR84CHATAPPMEN1MITF
SCHEMBL2745875 0.73 APP (0.41) CHATAPPMEN1MITFMAPT
SCHEMBL15477219 0.73 DNMT1 (0.42) GPR84MCL1CES1MEN1MAPT
SCHEMBL29489130 0.71 MCL1 (0.47) GPR84MCL1CES1STK10SLK
SCHEMBL28392347 0.69 APP (0.52) APPMEN1MAPTKMT2ACYP1A1
SCHEMBL338172 0.68 CES1 (0.55) GPR84CES1MEN1KMT2ASOS1
SCHEMBL2745872 0.67 APP (0.41) CHATAPPMEN1MITFMAPT
SCHEMBL2747318 0.67 FFAR1 (0.42) APPMEN1MAPTKMT2ADHFR
SCHEMBL25212172 0.67 CYP2A6 (0.41) PTPN22MCL1CYP1A2ALDH1A1HPGD
SCHEMBL18091340 0.67 APP (0.50) APPMEN1MAPTKMT2ACYP1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-7608928-B2 Laminated body and semiconductor device JSR CORPORATION (JP) 2009-10-27 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
US-20080044664-A1 Laminated Body and Semiconductor Drive JSR CORPORATION (JP) 2008-02-21 US disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed
EP-1760774-A1 LAMINATED BODY AND SEMICONDUCTOR DEVICE JSR Corporation (JP) 2007-03-07 EP disclosed