Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MCL1 | Q07820 | 1/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | CA1 | P00915 | 2/20 | 0.45 |
| ▸ | CA2 | P00918 | 2/20 | 0.45 |
| ▸ | PIM1 | P11309 | 3/20 | 0.43 |
| ▸ | CLK1 | P49759 | 1/20 | 0.41 |
| ▸ | DYRK1A | Q13627 | 1/20 | 0.41 |
| ▸ | NCOA3 | Q9Y6Q9 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.39 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.38 |
| ▸ | CES1 | P23141 | 1/20 | 0.38 |
| ▸ | ANPEP | P15144 | 1/20 | 0.38 |
| ▸ | STK10 | O94804 | 1/20 | 0.38 |
| ▸ | SLK | Q9H2G2 | 1/20 | 0.38 |
| ▸ | SLC22A12 | Q96S37 | 2/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29110490 | 0.90 | MCL1 (0.49) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL23081379 | 0.83 | ALDH1A1 (0.41) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL6281734 | 0.81 | CA1 (0.43) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL29110487 | 0.81 | CA1 (0.38) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL5012665 | 0.80 | PDE9A (0.46) | KDM4ECA1CA2CLK1DYRK1A | |
| SCHEMBL29039496 | 0.80 | CA1 (0.50) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL769609 | 0.79 | CA1 (0.46) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL30135211 | 0.78 | CA1 (0.46) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL29152139 | 0.78 | KDM4E (0.50) | MCL1KDM4ECA1CA2PIM1 | |
| SCHEMBL31457372 | 0.77 | CLK1 (0.49) | MCL1KDM4ECA1CA2CLK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120092029-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-114787120-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-116813824-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-113348079-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-112204105-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-04-14 | — | — | CN | disclosed |
| CN-114867711-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-04-11 | — | — | CN | disclosed |
| CN-115032863-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-115003716-A | Resin composition, resin sheet, prepreg, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-113795522-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114787276-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-113242996-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-110198968-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-110869409-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-05-31 | — | — | CN | disclosed |
| CN-110997755-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-109415491-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-110869410-B | Resin composition for printed wiring board, prepreg, resin sheet, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2022-04-26 | — | — | CN | disclosed |
| CN-109415489-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-03-04 | — | — | CN | disclosed |