SCHEMBL274743

SCHEMBL274743

CC(OCCCCO)OCCCCO

nearest known ligand 0.36

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
ALDH1A1 P00352 3/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
HSD17B10 Q99714 1/20 0.35
TSHR P16473 1/20 0.35
ACHE P22303 6/20 0.31
THRB P10828 1/20 0.31
HTT P42858 1/20 0.31
MAPT P10636 1/20 0.31
CNR1 P21554 1/20 0.31
CNR2 P34972 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL32678393 1.00 LMNA (0.36) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL32678392 1.00 LMNA (0.36) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL13190211 0.91 SMN1; SMN2 (0.48) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL25891403 0.89 LMNA (0.56) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL28558668 0.89 LMNA (0.44) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL15384198 0.87 SMN1; SMN2 (0.32) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL195733 0.83
SCHEMBL10434124 0.82 LMNA (0.57) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL159022 0.82 TSHR (0.46) LMNASMN1; SMN2ALDH1A1MEN1KMT2A
1-Pentanol SCHEMBL9803025 0.82 SMN1; SMN2 (0.50) LMNASMN1; SMN2ALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026041475-A1 NITROGEN-CONTAINING KETAL OR ACETAL ALKOXYLATES AND THEIR USE BASF SE (DE) 2026-02-26 WO disclosed
US-9524863-B2 Method for cleaning and drying semiconductor substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-20 US disclosed
US-9372404-B2 Organic film composition, method for forming organic film and patterning process using this, and heat-decomposable polymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-21 US disclosed
US-20150221500-A1 METHOD FOR CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-08-06 US disclosed
US-20130302990-A1 ORGANIC FILM COMPOSITION, METHOD FOR FORMING ORGANIC FILM AND PATTERNING PROCESS USING THIS, AND HEAT-DECOMPOSABLE POLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-11-14 US disclosed
EP-1894957-B1 Flexographic printing plate precursor of laser engraving type FUJIFILM CORP (JP) 2012-10-17 EP disclosed
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed