SCHEMBL27558779

SCHEMBL27558779

O=C(O)/C(Br)=C(/Br)C(=O)O.[NaH].[NaH]

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
LDHA P00338 1/20 0.33
LDHB P07195 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA9 Q16790 1/20 0.33
TSHR P16473 1/20 0.31
ALDH1A1 P00352 1/20 0.31
THRB P10828 1/20 0.31
RECQL P46063 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL713652 0.95 CA1 (0.36) LDHALDHBCA1CA2CA9
SCHEMBL713653 0.95 CA1 (0.36) LDHALDHBCA1CA2CA9
SCHEMBL10942185 0.95 CA1 (0.36) LDHALDHBCA1CA2CA9
Hydrochloric Acid SCHEMBL9621809 0.91 LDHA (0.33) LDHALDHBCA1CA2CA9
SCHEMBL1405628 0.78
SCHEMBL6908812 0.75
SCHEMBL6915265 0.75
SCHEMBL10525163 0.75
SCHEMBL6913983 0.75
SCHEMBL6912785 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1314761-C Filler reinforced polyether imide resin composition and molded article thereof GEN ELECTRIC (US) 2007-05-09 CN disclosed
CN-1659234-A filler-reinforced polyetherimide resin composition and molded article thereof GEN ELECTRIC (US) 2005-08-24 CN disclosed