SCHEMBL27587282

SCHEMBL27587282

COc1ccc(-c2ncnc(C(Br)(Br)Br)n2)cc1

nearest known ligand 0.49

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CLK4 Q9HAZ1 3/20 0.49
MAPT P10636 5/20 0.47
KDM4E B2RXH2 1/20 0.47
TP53 P04637 1/20 0.47
NPC1 O15118 6/20 0.46
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
ALDH1A1 P00352 1/20 0.40
RAB9A P51151 4/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
NPSR1 Q6W5P4 1/20 0.40
S1PR1 P21453 1/20 0.40
NR1H4 Q96RI1 1/20 0.40
ADORA3 P0DMS8 1/20 0.39
XDH P47989 1/20 0.39
PDGFRB P09619 1/20 0.39
PDGFRA P16234 1/20 0.39
SIRT2 Q8IXJ6 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL644691 0.85 CLK4 (0.47) CLK4MAPTKDM4ETP53NPC1
SCHEMBL28849727 0.84 CLK4 (0.61) CLK4MAPTKDM4ETP53NPC1
SCHEMBL1044951 0.82 CLK4 (0.50) CLK4MAPTKDM4ETP53NPC1
SCHEMBL29043172 0.79 CLK4 (0.52) CLK4MAPTKDM4ETP53NPC1
SCHEMBL29428939 0.77 S1PR1 (0.58) CLK4MAPTKDM4ETP53NPC1
SCHEMBL6949389 0.77 S1PR1 (0.58) CLK4MAPTKDM4ETP53NPC1
SCHEMBL7917933 0.76 MAPT (0.69) CLK4MAPTKDM4ETP53NPC1
SCHEMBL30760718 0.76 S1PR1 (0.57) CLK4MAPTKDM4ETP53NPC1
SCHEMBL27719386 0.76 CLK4 (0.52) CLK4MAPTKDM4ETP53NPC1
SCHEMBL14432249 0.76 KMT2A (0.53) CLK4MAPTKDM4ETP53NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 CN disclosed
CN-118011733-A Positive photosensitive resin composition, resist film, resist underlayer film, and resist permanent film DIC株式会社 2024-05-10 CN disclosed
CN-117075428-A Negative photosensitive resin composition DIC株式会社 2023-11-17 CN disclosed
CN-110959138-B Resist material DIC株式会社 2023-06-30 CN disclosed
CN-115480447-A Negative photosensitive resin composition DIC株式会社 2022-12-16 CN disclosed
CN-113348188-A Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2021-09-03 CN disclosed
CN-108368214-B Novolac resin and resist film DIC株式会社 2021-03-23 CN disclosed
CN-108290828-B Oxime ester compound having excellent thermal stability, photopolymerization initiator containing the same, and photosensitive resin composition 京仁洋行股份有限公司 2021-01-26 CN disclosed
CN-108368213-B Novolac resin and resist film DIC株式会社 2020-12-18 CN disclosed
CN-107003612-B Photosensitive composition for forming resist underlayer film, and resist underlayer film DIC株式会社 2020-11-06 CN disclosed
CN-110959138-A Resist material DIC株式会社 2020-04-03 CN disclosed
CN-108290828-A Oxime ester compound having excellent thermal stability, photopolymerization initiator containing the same, and photosensitive resin composition 京仁洋行股份有限公司 2018-07-17 CN disclosed
CN-105555820-A Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating DAINIPPON INK & CHEMICALS 2016-05-04 CN disclosed
CN-105190439-A Modified phenolic novolac resin, resist material, coating film, and permanent resist film DAINIPPON INK &AMP 2015-12-23 CN disclosed
CN-1527808-A Process for production of fluorine-containing norbornene derivatives ͬ�Ϳ�ҵ��ʽ���� 2004-09-08 CN disclosed