SCHEMBL27614767

SCHEMBL27614767

CCO[Si](C)(CCCC(=O)Nc1ccc(OC)cc1)OCC

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.67
HDAC1 Q13547 3/20 0.60
HDAC8 Q9BY41 3/20 0.60
HDAC3 O15379 2/20 0.60
HDAC4 P56524 2/20 0.60
HDAC7 Q8WUI4 2/20 0.60
HDAC2 Q92769 2/20 0.60
HDAC10 Q969S8 2/20 0.60
HDAC11 Q96DB2 2/20 0.60
HDAC6 Q9UBN7 2/20 0.60
HDAC9 Q9UKV0 2/20 0.60
HDAC5 Q9UQL6 2/20 0.60
ALDH1A1 P00352 4/20 0.56
LMNA P02545 2/20 0.56
HTT P42858 1/20 0.56
CNR1 P21554 2/20 0.55
KMT2A Q03164 4/20 0.54
MAPT P10636 5/20 0.54
CNR2 P34972 1/20 0.54
TP53 P04637 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27595992 0.88 L3MBTL1 (0.68) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL27596294 0.88 L3MBTL1 (0.72) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL27596029 0.86 L3MBTL1 (0.65) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL28771846 0.82 L3MBTL1 (0.77) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL27718864 0.80 L3MBTL1 (0.68) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL13753202 0.80 L3MBTL1 (0.84) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL27291378 0.80 L3MBTL1 (0.96) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL24262955 0.79 L3MBTL1 (0.87) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL10647695 0.77 L3MBTL1 (0.84) L3MBTL1HDAC1HDAC8HDAC3HDAC4
SCHEMBL30021084 0.77 L3MBTL1 (0.84) L3MBTL1HDAC1HDAC8HDAC3HDAC4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101223235-B Epoxy resin composition for sealing and electronic component device HITACHI CHEMICAL CO LTD 2011-07-27 CN disclosed
CN-101412838-B Epoxy resin composition for packaging and electronic components employing same HITACHI CHEMICAL CO LTD 2011-02-09 CN disclosed
CN-100509908-C Epoxy resin composition for encapsulation and electronic component using the same HITACHI CHEMICAL CO LTD (JP) 2009-07-08 CN disclosed
CN-101412838-A Epoxy resin molding material for sealing and electronic part apparatus HITACHI CHEMICAL CO LTD (JP) 2009-04-22 CN disclosed
CN-101223235-A Epoxy resin composition for sealing and electronic component device HITACHI CHEMICAL CO LTD (JP) 2008-07-16 CN disclosed
CN-1639224-A Epoxy resin composition for encapsulation and electronic component using the same HITACHI CHEMICAL CO LTD (JP) 2005-07-13 CN disclosed
CN-1639258-A Epoxy resin composition for encapsulation and electronic component using the same HITACHI CHEMICAL CO LTD (JP) 2005-07-13 CN disclosed