Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.61 |
| ▸ | LMNA | P02545 | 2/20 | 0.57 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.56 |
| ▸ | NAAA | Q02083 | 1/20 | 0.56 |
| ▸ | PAM | P19021 | 2/20 | 0.55 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.55 |
| ▸ | CES2 | O00748 | 3/20 | 0.54 |
| ▸ | CES1 | P23141 | 3/20 | 0.54 |
| ▸ | MAPT | P10636 | 1/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.53 |
| ▸ | PPARG | P37231 | 4/20 | 0.52 |
| ▸ | PPARD | Q03181 | 4/20 | 0.52 |
| ▸ | PPARA | Q07869 | 4/20 | 0.52 |
| ▸ | TSHR | P16473 | 3/20 | 0.52 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.52 |
| ▸ | HDAC11 | Q96DB2 | 3/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.52 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.52 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.52 |
| ▸ | TLR2 | O60603 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL192087 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL4631663 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL3672434 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL30337624 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL1698301 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL4632103 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL28431607 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL6898473 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL4480655 | 1.00 | DGKA (0.61) | DGKALMNAALDH1A1NAAAPAM | |
| SCHEMBL11128008 | 0.98 | DGKA (0.59) | DGKALMNAALDH1A1NAAAPAM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107936186-B | 3D printing wire and preparation method thereof | 中国石油化工股份有限公司 | 2020-06-09 | — | — | CN | claimed |
| CN-107793708-A | Thermoplastic cellulose and aliphatic aromatic copolyester blends and preparation method | 中国石油化工股份有限公司 | 2018-03-13 | — | — | CN | claimed |
| US-6740698-B2 | USEFUL IN OXYGEN-SENSITIVE FOOD, BEVERAGE, PHARMACEUTICAL AND HEALTH CARE PRODUCT PACKAGING; FILM, A BOTTLE OR A CONTAINER | HONEYWELL INTERNATIONAL INC. | 2004-05-25 | — | — | US | claimed |
| US-20030045640-A1 | Oxygen scavenging high barrier polyamide compositions for packaging applications | HONEYWELL INTERNATIONAL INC. | 2003-03-06 | — | — | US | claimed |
| CN-1043397-A | UV-curable composition for making solder mask coatings with coverability | M & T CHEMICALS INC (US) | 1990-06-27 | — | — | CN | claimed |
| WO-2024095822-A1 | METHOD FOR PRODUCING FIBER-REINFORCED CELLULOSE-BASED RESIN | 日本電気株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2023209790-A1 | PARAMYLON-BASED RESIN, METHOD FOR PRODUCING SAME, RESIN COMPOSITION FOR MOLDING, AND MOLDED OBJECT | 日本電気株式会社 | 2023-11-02 | — | — | WO | disclosed |
| US-20230272123-A1 | PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN | NEC CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-116509735-A | Fragrance and flavor compositions containing acetophenone derivatives | 西姆莱斯股份公司 | 2023-08-01 | — | — | CN | disclosed |
| US-20230174681-A1 | PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND PRODUCTION METHOD FOR PARAMYLON-BASED RESIN | NEC CORPORATION (JP) | 2023-06-08 | — | — | US | disclosed |
| EP-4148088-A1 | PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND PRODUCTION METHOD FOR PARAMYLON-BASED RESIN | NEC Corporation (JP) | 2023-03-15 | — | — | EP | disclosed |
| US-11572416-B2 | Cellulose resin, molding material, molded body, and method for producing cellulose resin | NEC CORPORATION (JP) | 2023-02-07 | — | — | US | disclosed |
| WO-2010130708-A1 | BETA-LACTAMASE INHIBITORS | NOVARTIS INTERNATIONAL PHARMACEUTICAL LTD. (BM) | 2010-11-18 | — | — | WO | disclosed |
| EP-1924240-A1 | PERSONAL CARE PRODUCTS INCORPORATING CELLULOSIC FATTY ACID ESTERS | EASTMAN CHEMICAL COMPANY (US) | 2008-05-28 | — | — | EP | disclosed |
| WO-2007033252-A1 | PERSONAL CARE PRODUCTS INCORPORATING CELLULOSIC FATTY ACID ESTERS | EASTMAN CHEMICAL COMPANY (US) | 2007-03-22 | — | — | WO | disclosed |
| US-20070053855-A1 | Personal care products incorporating cellulosic fatty acid esters | EASTMAN CHEMICAL COMPANY | 2007-03-08 | — | — | US | disclosed |
| EP-1654197-A1 | CARRIER BASED ON GRANULES PRODUCED FROM PYROGENICALLY PREPARED SILICON DIOXIDES | Degussa AG (DE) | 2006-05-10 | — | — | EP | disclosed |
| WO-2005016823-A1 | CARRIER BASED ON GRANULES PRODUCED FROM PYROGENICALLY PREPARED SILICON DIOXIDES | DEGUSSA AG (DE) | 2005-02-24 | — | — | WO | disclosed |
| CN-1043397-A | UV-curable composition for making solder mask coatings with coverability | M & T CHEMICALS INC (US) | 1990-06-27 | — | — | CN | disclosed |
| US-4559226-A | PREVENT CHALKING OF ANTIPERSPIRANTS CONTAINING UOLATILE SILICONE OILS | BERNEL CHEMICAL COMPANY INC. (US) | 1985-12-17 | — | — | US | disclosed |