⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27877853 | 1.00 | — | — | |
| SCHEMBL30556428 | 1.00 | — | — | |
| SCHEMBL28168572 | 1.00 | — | — | |
| SCHEMBL3242892 | 0.87 | — | — | |
| SCHEMBL29155794 | 0.87 | — | — | |
| SCHEMBL28203490 | 0.87 | — | — | |
| SCHEMBL2768841 | 0.87 | — | — | |
| SCHEMBL31668846 | 0.87 | — | — | |
| SCHEMBL2771044 | 0.87 | — | — | |
| SCHEMBL66598 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 231 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115430874-B | Method for preparing nano twin crystal copper layer by high-frequency pulse wire-cut electric discharge machine | 武汉大学 | 2025-03-28 | — | — | CN | claimed |
| CN-114406460-B | Laser bar packaging structure, welding fixture and method | 苏州尤诗光电科技有限公司 | 2025-02-07 | — | — | CN | claimed |
| CN-117660795-A | Tungsten-molybdenum-copper composite material and preparation method thereof | 河南科技大学 | 2024-03-08 | — | — | CN | claimed |
| CN-115430874-A | Method for preparing nanometer twin copper layer by high-frequency pulse wire cut electrical discharge machining | 武汉大学 | 2022-12-06 | — | — | CN | claimed |
| US-11462602-B2 | Array substrate, manufacturing method thereof, and display device | HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2022-10-04 | — | — | US | claimed |
| CN-114050195-B | Flexible CIC battery and preparation method and application thereof | 北京博瑞原子空间能源科技有限公司 | 2022-07-26 | — | — | CN | claimed |
| CN-112892853-B | Comprehensive recovery beneficiation process for wolframite and associated valuable metals thereof | 武汉理工大学 | 2022-05-10 | — | — | CN | claimed |
| CN-114406460-A | Laser bar packaging structure, welding fixture and method | 苏州尤诗光电科技有限公司 | 2022-04-29 | — | — | CN | claimed |
| CN-114122227-A | Inverted flexible GaN-based LED and preparation method thereof | 山东省科学院激光研究所 | 2022-03-01 | — | — | CN | claimed |
| CN-114050195-A | Flexible CIC battery and preparation method and application thereof | 北京博瑞原子空间能源科技有限公司 | 2022-02-15 | — | — | CN | claimed |
| US-20160293628-A1 | THIN FILM TRANSISTOR ARRAY SUBSTRATE, ITS MANUFACTURING METHOD AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2016-10-06 | — | — | US | claimed |
| CN-103194629-B | Method for preparing tungsten molybdenum copper composite material | JINDUICHENG MOLYBDENUM CO LTD | 2015-06-10 | — | — | CN | claimed |
| CN-101676543-A | Application of tungsten-molybdenum-copper bainite grey cast iron in air cylinder sleeve of engine of boat and ship | XINGYE WEI | 2010-03-24 | — | — | CN | claimed |
| CN-101214553-A | Method for preparing ultra-fine/nano tungsten molybdenum copper composite powder | UNIV CENTRAL SOUTH (CN) | 2008-07-09 | — | — | CN | claimed |
| EP-0757383-B1 | Plate type member for semiconductor device package | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2002-05-29 | — | — | EP | claimed |
| US-20020018500-A1 | Semiconductor laser unit and semiconductor laser module | THE FURUKAWA ELECTRIC CO., LTD (JP) | 2002-02-14 | — | — | US | claimed |
| US-6316826-B1 | Semiconductor mounting package | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2001-11-13 | — | — | US | claimed |
| EP-0991121-A2 | Semiconductor mounting package for heat dissipation | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2000-04-05 | — | — | EP | claimed |
| US-5990548-A | COPPER ALLOY | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1999-11-23 | — | — | US | claimed |
| EP-0757383-A2 | Plate type member for semiconductor device package | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1997-02-05 | — | — | EP | claimed |