Dimethylamine

Dimethylamine

SCHEMBL27709019

CNC.C[SiH3]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Dimethylamine SCHEMBL28348468 1.00
Dimethylamine SCHEMBL17046135 0.83
Dimethylamine SCHEMBL1330452 0.82
Dimethylamine SCHEMBL5164633 0.82
Dimethylamine SCHEMBL12415750 0.82
Dimethylamine SCHEMBL392668 0.82
Dimethylamine SCHEMBL1030 0.82
Dimethylamine SCHEMBL13695986 0.82
Dimethylamine SCHEMBL28074402 0.77
Dimethylamine SCHEMBL1003093 0.73 KDM4E (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104379633-A Composition for surface treatment, methods of preparing surface-treated article, and surface treated article DOW CORNING 2015-02-25 CN claimed
CN-101154583-B Method of forming pattern of semiconductor device HYNIX SEMICONDUCTOR INC 2012-12-19 CN claimed
CN-101154583-A Method of forming pattern of semiconductor device HYNIX SEMICONDUCTOR INC (KR) 2008-04-02 CN claimed
CN-106200289-A Imaging device and formation method 富士施乐株式会社 2016-12-07 CN disclosed
CN-105034473-A BONDED OBJECT OF THREE-DIMENSIONAL SILICONE RUBBER ASAHI RUBBER INC 2015-11-11 CN disclosed
CN-102159394-B Three-dimensional silicon rubber adhesive body ASAHI RUBBER INC 2015-04-01 CN disclosed
CN-104379633-A Composition for surface treatment, methods of preparing surface-treated article, and surface treated article DOW CORNING 2015-02-25 CN disclosed
CN-101154583-B Method of forming pattern of semiconductor device HYNIX SEMICONDUCTOR INC 2012-12-19 CN disclosed
CN-102159394-A Three-dimensional silicon rubber adhesive body ASAHI RUBBER INC 2011-08-17 CN disclosed
CN-101154583-A Method of forming pattern of semiconductor device HYNIX SEMICONDUCTOR INC (KR) 2008-04-02 CN disclosed