Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenol SCHEMBL8731868 | 0.84 | CA12 (0.37) | — | |
| SCHEMBL2474454 | 0.82 | GSK3A (0.31) | GSK3AGSK3B | |
| SCHEMBL2903592 | 0.82 | GSK3A (0.31) | GSK3AGSK3B | |
| SCHEMBL9841986 | 0.80 | GSK3A (0.36) | GSK3AGSK3B | |
| SCHEMBL2773971 | 0.73 | TP53 (0.30) | — | |
| SCHEMBL10595996 | 0.71 | SRC (0.32) | — | |
| SCHEMBL6817629 | 0.70 | — | — | |
| SCHEMBL31401881 | 0.69 | — | — | |
| SCHEMBL9063709 | 0.68 | GSK3A (0.31) | GSK3AGSK3B | |
| SCHEMBL12038664 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220169819-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3677624-B1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI KASEI CO LTD (JP) | 2022-05-18 | — | — | EP | disclosed |
| EP-3950792-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-20220010089-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | SEKISUI KASEI CO., LTD. (JP) | 2022-01-13 | — | — | US | disclosed |
| EP-3858906-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | Sekisui Kasei Co., Ltd. (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-11052398-B2 | Plastic microfluidic separation and detection platforms | ANDE CORPORATION (US) | 2021-07-06 | — | — | US | disclosed |
| US-10988594-B2 | Polycarbonate-based resin foam particle and foam molded body | SEKISUI PLASTICS CO., LTD. (JP) | 2021-04-27 | — | — | US | disclosed |
| EP-3677624-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | Sekisui Plastics Co., Ltd. (JP) | 2020-07-08 | — | — | EP | disclosed |
| US-20200123339-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI PLASTICS CO., LTD. (JP) | 2020-04-23 | — | — | US | disclosed |
| EP-3626345-A1 | SYSTEMS FOR RAPID MULTIPLEXED AMPLIFICATION OF TARGET NUCLEIC ACIDS | ANDE Corporation (US) | 2020-03-25 | — | — | EP | disclosed |
| US-4748149-A | Thermal print element comprising a yellow merocyanine dye stabilized with a cyan indoaniline dye | EASTMAN KODAK COMPANY (US) | 1988-05-31 | — | — | US | disclosed |
| US-4738949-A | High-security identification card obtained by thermal dye transfer | EASTMAN KODAK COMPANY (US) | 1988-04-19 | — | — | US | disclosed |
| US-4725574-A | PHOTOSTABILITY | BYERS GARY W (US) | 1988-02-16 | — | — | US | disclosed |
| US-4713365-A | POLYESTER COPOLYMERS; PROTECTIVE DEVICES | EASTMAN KODAK COMPANY (US) | 1987-12-15 | — | — | US | disclosed |
| US-4695286-A | High molecular weight polycarbonate receiving layer used in thermal dye transfer | EASTMAN KODAK COMPANY (US) | 1987-09-22 | — | — | US | disclosed |
| EP-0227094-A2 | High molecular weight polycarbonate receiving layer used in thermal dye transfer | EASTMAN KODAK COMPANY (a New Jersey corporation) (US) | 1987-07-01 | — | — | EP | disclosed |
| EP-0086653-B1 | PHOTOSENSITIVE RESIN COMPOSITION | Toyo Boseki Kabushiki Kaisha (JP) | 1987-02-04 | — | — | EP | disclosed |
| US-4544624-A | Photosensitive resin composition | TOYO BOSEKI KABNUSHIKI KAISHA (JP) | 1985-10-01 | — | — | US | disclosed |
| EP-0147747-A2 | Heat-transfer image-receiving element | KONICA CORPORATION (JP) | 1985-07-10 | — | — | EP | disclosed |
| EP-0086653-A2 | Photosensitive resin composition | Toyo Boseki Kabushiki Kaisha (JP) | 1983-08-24 | — | — | EP | disclosed |