Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.30 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9080322 | 0.84 | — | — | |
| SCHEMBL2474454 | 0.74 | GSK3A (0.31) | — | |
| SCHEMBL12030900 | 0.73 | GSK3A (0.33) | — | |
| SCHEMBL2771196 | 0.73 | GSK3A (0.33) | — | |
| SCHEMBL9841986 | 0.72 | GSK3A (0.36) | — | |
| SCHEMBL6817629 | 0.70 | — | — | |
| SCHEMBL2903592 | 0.69 | GSK3A (0.31) | — | |
| SCHEMBL3873607 | 0.65 | GSK3A (0.31) | — | |
| Phenol SCHEMBL8731868 | 0.65 | CA12 (0.37) | — | |
| SCHEMBL3881256 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220169819-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3677624-B1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI KASEI CO LTD (JP) | 2022-05-18 | — | — | EP | disclosed |
| EP-3950792-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-20220010089-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | SEKISUI KASEI CO., LTD. (JP) | 2022-01-13 | — | — | US | disclosed |
| EP-3858906-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | Sekisui Kasei Co., Ltd. (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-10988594-B2 | Polycarbonate-based resin foam particle and foam molded body | SEKISUI PLASTICS CO., LTD. (JP) | 2021-04-27 | — | — | US | disclosed |
| EP-3677624-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | Sekisui Plastics Co., Ltd. (JP) | 2020-07-08 | — | — | EP | disclosed |
| US-20200123339-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI PLASTICS CO., LTD. (JP) | 2020-04-23 | — | — | US | disclosed |
| US-20190248978-A1 | POLYCARBONATE-BASED RESIN FOAM PARTICLE AND FOAM MOLDED BODY | SEKISUI PLASTICS CO., LTD. (JP) | 2019-08-15 | — | — | US | disclosed |
| EP-3511370-A1 | POLYCARBONATE-BASED RESIN FOAM PARTICLE AND FOAM MOLDED BODY | Sekisui Plastics Co., Ltd. (JP) | 2019-07-17 | — | — | EP | disclosed |
| US-6136444-A | Transparent conductive sheet | TEIJIN LIMITED (JP) | 2000-10-24 | — | — | US | disclosed |
| EP-0726579-A2 | Transparent conductive sheet | TEIJIN LIMITED (JP) | 1996-08-14 | — | — | EP | disclosed |
| US-5510233-A | HYDROPHILIC COLLOID SECOND SUBBING LAYER CONSISTING OF GELATIN; BONDING STRENGTH | FUJI PHOTO FILM CO., LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5378592-A | Subbing layer of urethane latex and one of gelatin, improved adhesion | FUJI PHOTO FILM CO., LTD. (JP) | 1995-01-03 | — | — | US | disclosed |
| EP-0147747-B1 | HEAT-TRANSFER IMAGE-RECEIVING ELEMENT | KONICA CORPORATION (JP) | 1990-06-06 | — | — | EP | disclosed |
| US-4840870-A | DISCOLORATION INHIBITION | KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) | 1989-06-20 | — | — | US | disclosed |
| EP-0086653-B1 | PHOTOSENSITIVE RESIN COMPOSITION | Toyo Boseki Kabushiki Kaisha (JP) | 1987-02-04 | — | — | EP | disclosed |
| US-4544624-A | Photosensitive resin composition | TOYO BOSEKI KABNUSHIKI KAISHA (JP) | 1985-10-01 | — | — | US | disclosed |
| EP-0147747-A2 | Heat-transfer image-receiving element | KONICA CORPORATION (JP) | 1985-07-10 | — | — | EP | disclosed |
| EP-0086653-A2 | Photosensitive resin composition | Toyo Boseki Kabushiki Kaisha (JP) | 1983-08-24 | — | — | EP | disclosed |