SCHEMBL2771808

SCHEMBL2771808

CCC[SiH](C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12898484 0.82
SCHEMBL3482093 0.81
SCHEMBL10431307 0.79
SCHEMBL7052841 0.77 TSHR (0.42)
SCHEMBL18804467 0.77 TSHR (0.42)
SCHEMBL7055968 0.77 TSHR (0.42)
SCHEMBL4971685 0.77 TSHR (0.42)
SCHEMBL27993585 0.77 TSHR (0.42)
SCHEMBL14926514 0.76
SCHEMBL7769057 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4018015-A1 MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM Versum Materials US, LLC (US) 2022-06-29 EP claimed
WO-2021050798-A1 MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM VERSUM MATERIALS US, LLC (US) 2021-03-18 WO claimed
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
CN-119731271-A Silicone resin composition 捷恩智株式会社 2025-03-28 CN disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
CN-117321141-A Solvent-free composition 日产化学株式会社 2023-12-29 CN disclosed
CN-113518794-B Addition-curable silicone adhesive composition 迈图高新材料公司 2023-12-22 CN disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
CN-115066475-A Addition curable silicone adhesive composition 迈图高新材料公司 2022-09-16 CN disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed
US-5624680-A SKIN ABSORPTION OF DRUGS WITH POLYETHERSILOXANE BLOCK COPOLYMERS SAGAMI CHEMICAL RESEARCH CENTER (JP) 1997-04-29 US disclosed
EP-0710688-A1 HYDROXYSILYL-TERMINATED POLYOXYETHYLENE COMPOUND, QUATERNARY-SALT-TERMINATED BLOCK COPOLYMER, AND PERCUTANEOUS ABSORPTION PROMOTER SAGAMI CHEMICAL RESEARCH CENTER (JP) 1996-05-08 EP disclosed