⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10416049 | 0.76 | ACHE (0.32) | — | |
| SCHEMBL958607 | 0.75 | — | — | |
| SCHEMBL3853198 | 0.72 | — | — | |
| SCHEMBL1485897 | 0.72 | — | — | |
| SCHEMBL924241 | 0.72 | — | — | |
| SCHEMBL8575865 | 0.72 | — | — | |
| SCHEMBL18076018 | 0.72 | — | — | |
| SCHEMBL2591738 | 0.72 | — | — | |
| SCHEMBL4477480 | 0.72 | — | — | |
| SCHEMBL3137742 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | claimed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | claimed |
| US-20220298625-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2022-09-22 | — | — | US | claimed |
| US-11384429-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2022-07-12 | — | — | US | claimed |
| US-12564025-B2 | Interconnect with redeposited metal capping and method forming same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2026-02-24 | — | — | US | disclosed |
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | disclosed |
| US-20240213088-A1 | SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES | APPLIED MATERIALS, INC. | 2024-06-27 | — | — | US | disclosed |
| US-11990368-B2 | Doped selective metal caps to improve copper electromigration with ruthenium liner | APPLIED MATERIALS, INC. (US) | 2024-05-21 | — | — | US | disclosed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | disclosed |
| US-11923244-B2 | Subtractive metals and subtractive metal semiconductor structures | APPLIED MATERIALS, INC. (US) | 2024-03-05 | — | — | US | disclosed |
| US-11875987-B2 | Contacts having a geometry to reduce resistance | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2024-01-16 | — | — | US | disclosed |
| US-20230048536-A1 | Interconnect with Redeposited Metal Capping and Method Forming Same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2023-02-16 | — | — | US | disclosed |
| US-11373903-B2 | Doped selective metal caps to improve copper electromigration with ruthenium liner | APPLIED MATERIALS, INC. (US) | 2022-06-28 | — | — | US | disclosed |
| CN-107078036-B | Method for thermally forming selective cobalt layer | 应用材料公司 | 2021-03-30 | — | — | CN | disclosed |
| CN-106024598-B | Cobalt deposition on barrier surfaces | 应用材料公司 | 2020-11-20 | — | — | CN | disclosed |
| CN-106463396-B | Dielectric/metal barrier integration to prevent copper diffusion | 应用材料公司 | 2020-03-10 | — | — | CN | disclosed |
| CN-106415829-A | Protective via cap for improved interconnect performance | 应用材料公司 | 2017-02-15 | — | — | CN | disclosed |
| CN-101466863-B | Process for forming cobalt-containing materials | APPLIED MATERIALS INC | 2011-08-10 | — | — | CN | disclosed |
| CN-101578390-A | Cobalt-containing film-forming material and method for forming cobalt silicide film using the material | SHOWA DENKO KK (JP) | 2009-11-11 | — | — | CN | disclosed |
| CN-101466863-A | Process for forming cobalt-containing materials | APPLIED MATERIALS INC (US) | 2009-06-24 | — | — | CN | disclosed |