SCHEMBL277662

SCHEMBL277662

CC([O])CC=CC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10991515 0.83
SCHEMBL15353 0.82
SCHEMBL15352 0.82
SCHEMBL12973059 0.82
SCHEMBL265515 0.80
SCHEMBL11465249 0.80
SCHEMBL453106 0.80
SCHEMBL19974831 0.80 TSHR (0.44)
SCHEMBL9446891 0.78
SCHEMBL6265115 0.78 GABRR1 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10126653-B2 Pattern forming method and resist composition FUJIFILM CORPORATION (JP) 2018-11-13 US disclosed
US-9551931-B2 Method of forming pattern, actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, process for manufacturing electronic device and electronic device FUJIFILM CORPORATION (JP) 2017-01-24 US disclosed
US-9551928-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2017-01-24 US disclosed
US-20160004157-A1 METHOD OF FORMING PATTERN, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, PROCESS FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-01-07 US disclosed
US-9081277-B2 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition FUJIFILM CORPORATION (JP) 2015-07-14 US disclosed
US-20150118621-A1 METHOD OF FORMING PATTERN AND ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2015-04-30 US disclosed
US-9017917-B2 Resist composition and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2015-04-28 US disclosed
US-20150111157-A1 METHOD OF FORMING PATTERN AND ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2015-04-23 US disclosed
US-8808961-B2 Composition, resist film, pattern forming method, and inkjet recording method FUJIFILM CORPORATION (JP) 2014-08-19 US disclosed
WO-2014007361-A1 METHOD OF FORMING PATTERN AND ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2014-01-09 WO disclosed
US-20070196766-A1 Photosensitive composition, pattern-forming method using the photosensitive composition and compounds used in the photosensitive composition FUJIFILM CORPORATION (JP) 2007-08-23 US disclosed
US-20070184384-A1 Novel sulfonium compound, photosensitive composition containing the compound and pattern-forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2007-08-09 US disclosed
US-20070172769-A1 Pattern forming method FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
US-20070172768-A1 Pattern forming method FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
US-20060210919-A1 Photosensitive composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2006-09-21 US disclosed
US-20060204890-A1 Positive photosensitive composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2006-09-14 US disclosed
US-20060040208-A1 Chemical amplification resist composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2006-02-23 US disclosed
US-20050277059-A1 Protective film-forming composition for immersion exposure and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2005-12-15 US disclosed
US-20050266336-A1 Photosensitive composition and pattern-forming method using the photosensitive composition FUJI PHOTO FILM CO., LTD. 2005-12-01 US disclosed
US-20040191676-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2004-09-30 US disclosed