SCHEMBL27779486

SCHEMBL27779486

CCc1nc(C)cn1-n1ccnc1

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.33
LMNA P02545 3/20 0.33
HTT P42858 2/20 0.33
CYP11B1 P15538 4/20 0.33
CYP11B2 P19099 4/20 0.33
CYP19A1 P11511 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
MAPT P10636 1/20 0.32
TP53 P04637 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27508793 0.77 TSHR (0.34) TSHRLMNAHTTCYP19A1SMN1; SMN2
SCHEMBL27469745 0.75 ALPG (0.33) TSHRLMNACYP11B1CYP11B2CYP19A1
SCHEMBL28039994 0.70 CYP17A1 (0.42) TSHRLMNACYP11B1CYP11B2CYP19A1
SCHEMBL29157792 0.68 SMN1; SMN2 (0.33) TSHRLMNAHTTSMN1; SMN2MAPT
SCHEMBL28474467 0.66 TSHR (0.33) TSHRLMNAHTTALDH1A1
SCHEMBL29101070 0.65 TLR8 (0.35) TSHRLMNAALDH1A1
SCHEMBL27895939 0.64 CYP2E1 (0.35) CYP11B1CYP11B2CYP19A1ALDH1A1
SCHEMBL27815856 0.64 CYP2E1 (0.37) TSHRCYP11B1CYP11B2CYP19A1
SCHEMBL27306894 0.63
SCHEMBL27624956 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111587267-A Alicyclic epoxy compound product 株式会社大赛璐 2020-08-25 CN disclosed
CN-103295977-A Semiconductor device SUMITOMO BAKELITE CO 2013-09-11 CN disclosed
CN-103295992-A Semiconductor device SUMITOMO BAKELITE CO 2013-09-11 CN disclosed
CN-103221480-A Epoxy resin composition for semiconductor encapsulation and semiconductor device SUMITOMO BAKELITE CO 2013-07-24 CN disclosed
CN-101698787-B Epoxy resin binder used for repairing blade and preparation method thereof ZHENJIANG ELECTRONIC CHEMICAL MATERIALS ENGINEERING RES CT 2013-01-09 CN disclosed
CN-102725836-A Semiconductor device SUMITOMO BAKELITE CO 2012-10-10 CN disclosed
CN-102666724-A Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition SUMITOMO BAKELITE CO 2012-09-12 CN disclosed
CN-102667568-A Image pickup device and method for manufacturing the image pickup device KONICA MINOLTA OPTO INC 2012-09-12 CN disclosed
CN-102576696-A Semiconductor device with a plurality of semiconductor chips SUMITOMO BAKELITE CO 2012-07-11 CN disclosed
CN-102449020-A Resin composition for semiconductor encapsulation, and semiconductor device SUMITOMO BAKELITE CO 2012-05-09 CN disclosed
CN-102165583-A Semiconductor device with a plurality of semiconductor chips SUMITOMO BAKELITE CO 2011-08-24 CN disclosed
CN-101698787-A Epoxy resin binder used for repairing blade and preparation method thereof ZHENJIANG ELECTRONIC CHEMICAL 2010-04-28 CN disclosed
CN-101605855-A Optical element, electronic module, and method for manufacturing electronic module KONICA MINOLTA OPTO INC (JP) 2009-12-16 CN disclosed