Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 4/20 | 0.50 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL278622 | 0.90 | ESR1 (0.63) | ESR1ESR2LMNAALOX12ACHE | |
| SCHEMBL12606673 | 0.88 | ESR1 (0.61) | ESR1ESR2LMNAALOX12ACHE | |
| SCHEMBL13410342 | 0.86 | ESR1 (0.39) | ESR1ESR2 | |
| SCHEMBL12606668 | 0.82 | ESR1 (0.57) | ESR1ESR2LMNAALOX12ACHE | |
| SCHEMBL13411021 | 0.81 | ESR1 (0.46) | ESR1ESR2LMNAALOX12ACHE | |
| SCHEMBL9075413 | 0.81 | ESR1 (0.63) | ESR1ESR2LMNAALOX12ACHE | |
| SCHEMBL17636602 | 0.80 | ESR1 (0.45) | ESR1ESR2 | |
| SCHEMBL15372532 | 0.80 | ESR2 (0.51) | ESR1ESR2ACHE | |
| SCHEMBL16313455 | 0.78 | ESR1 (0.49) | ESR1ESR2LMNAACHENPSR1 | |
| SCHEMBL12606670 | 0.77 | ESR1 (0.58) | ESR1ESR2LMNAACHENPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-7598009-B2 | Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device | FUJIFILM CORPORATION (JP) | 2009-10-06 | — | — | US | disclosed |
| US-20090035693-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |