⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2785699 | 0.80 | — | — | |
| SCHEMBL28800498 | 0.80 | — | — | |
| SCHEMBL4895394 | 0.79 | — | — | |
| SCHEMBL1587937 | 0.78 | SIRT2 (0.33) | — | |
| SCHEMBL27636115 | 0.76 | — | — | |
| SCHEMBL3420054 | 0.76 | — | — | |
| SCHEMBL28181549 | 0.73 | — | — | |
| SCHEMBL18396407 | 0.73 | SIRT2 (0.40) | — | |
| SCHEMBL3419150 | 0.73 | ALDH1A1 (0.31) | — | |
| SCHEMBL29341728 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| US-20230197630-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION | RESONAC CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| WO-2023047592-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-30 | — | — | WO | disclosed |
| CN-115668457-A | Method for producing electronic component, resin composition for temporary protection, and resin film for temporary protection | 昭和电工材料株式会社 | 2023-01-31 | — | — | CN | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-114730706-A | Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| US-8463099-B2 | Resin composition for optical material, resin film for optical material, and optical waveguide using them | HITACHI CHEMICAL COMPANY (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8383695-B2 | Phenoxy resin for optical material, resin composition for optical material, resin film for optical material and optical waveguide using those | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-02-26 | — | — | US | disclosed |
| US-20120270963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-10-25 | — | — | US | disclosed |
| EP-2182410-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS | Hitachi Chemical Company, Ltd. (JP) | 2010-05-05 | — | — | EP | disclosed |
| US-20100040339-A1 | RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-02-18 | — | — | US | disclosed |
| CN-101652396-A | Resin composition for optical material, resin film for optical material, and optical waveguide using same | HITACHI CHEMICAL CO LTD JP | 2010-02-17 | — | — | CN | disclosed |
| CN-101583908-A | Photosensitive resin composition, cured photosensitive resin product, photosensitive resin film, cured photosensitive resin film product, and optical waveguide produced by using those products | HITACHI CHEMICAL CO LTD (JP) | 2009-11-18 | — | — | CN | disclosed |
| EP-2112181-A1 | RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM | Hitachi Chemical Company, Ltd. (JP) | 2009-10-28 | — | — | EP | disclosed |
| US-20090062421-A1 | Phenoxy Resin for Optical Material, Resin Composition for Optical Material, Resin Film For Optical Material and Optical Waveguide Using Those | HITACHI CHEIMICAL COMPANY LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| EP-1995266-A1 | PHENOXY RESIN FOR OPTICAL MATERIAL, RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THOSE | Hitachi Chemical Co., Ltd. (JP) | 2008-11-26 | — | — | EP | disclosed |