⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28317585 | 1.00 | — | — | |
| SCHEMBL28047372 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL8716711 | 0.87 | — | — | |
| SCHEMBL28897554 | 0.87 | — | — | |
| SCHEMBL28964363 | 0.87 | — | — | |
| SCHEMBL9769953 | 0.87 | — | — | |
| SCHEMBL5943170 | 0.87 | — | — | |
| SCHEMBL29046539 | 0.87 | — | — | |
| SCHEMBL8694300 | 0.87 | — | — | |
| SCHEMBL453866 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 250 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4720648-A2 | X-RAY FLUORESCENCE ASSEMBLY AND SYSTEMS AND METHODS COMPRISING SAME | Veracio Ltd. (US) | 2026-04-08 | — | — | EP | claimed |
| CN-222538435-U | Copper-aluminum-titanium explosion composite board | 南阳赞诚新材料有限公司 | 2025-02-28 | — | — | CN | claimed |
| CN-119287209-A | Titanium aluminum intermetallic compound reinforced copper-based composite material and preparation method and application thereof | 长春工业大学 | 2025-01-10 | — | — | CN | claimed |
| WO-2024249261-A2 | X-RAY FLUORESCENCE ASSEMBLY AND SYSTEMS AND METHODS COMPRISING SAME | VERACIO LTD. (US) | 2024-12-05 | — | — | WO | claimed |
| CN-118621137-A | Method for synchronously removing titanium aluminum copper from waste lithium iron phosphate powder leaching solution | 上海稀固科技有限公司 | 2024-09-10 | — | — | CN | claimed |
| CN-108269844-B | Transistor with source field plate and non-overlapping gate conductor layer | 德克萨斯仪器股份有限公司 | 2023-12-19 | — | — | CN | claimed |
| CN-108269845-B | Transistor with source field plate under gate runner layer | 德克萨斯仪器股份有限公司 | 2023-07-07 | — | — | CN | claimed |
| CN-115446319-B | Method for preparing spherical micro powder of titanium alloy and titanium-aluminum alloy with assistance of copper | 南京大学 | 2023-06-20 | — | — | CN | claimed |
| CN-111656518-B | Copper-titanium-aluminum junction, insulating circuit board with heat sink, power or LED or thermoelectric module | 三菱综合材料株式会社 | 2023-05-16 | — | — | CN | claimed |
| CN-218948632-U | Copper-aluminum-titanium explosion composite board | 无锡皖东金属材料有限公司 | 2023-05-02 | — | — | CN | claimed |
| US-6777810-B2 | Interconnection alloy for integrated circuits | INTEL CORPORATION | 2004-08-17 | — | — | US | claimed |
| US-20040056361-A1 | Multi-layered copper bond pad for an integrated circuit | MCTEER ALLEN (US) | 2004-03-25 | — | — | US | claimed |
| US-6642623-B2 | Multi-layered copper bond pad for an integrated circuit | MICRON TECHNOLOGY, INC. | 2003-11-04 | — | — | US | claimed |
| US-20030160330-A1 | Multilayer bonding pad; overcoating copper with titanium-aluminum alloy; passivation, annealing | MICRON TECHNOLOGY, INC. | 2003-08-28 | — | — | US | claimed |
| US-20020093103-A1 | INTERCONNECTION ALLOY FOR INTEGRATED CIRCUITS | INTEL CORPORATION | 2002-07-18 | — | — | US | claimed |
| US-20020090804-A1 | Copper interconnect for an integrated circuit and methods for its fabrication | MICRON TECHNOLOGY, INC. | 2002-07-11 | — | — | US | claimed |
| US-6373137-B1 | Copper interconnect for an integrated circuit and methods for its fabrication | MICRON TECHNOLOGY, INC. | 2002-04-16 | — | — | US | claimed |
| EP-0187968-B1 | ADHESION CHARACTERIZATION TEST SITE | International Business Machines Corporation (US) | 1990-04-04 | — | — | EP | claimed |
| US-4612805-A | Adhesion characterization test site | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1986-09-23 | — | — | US | claimed |
| EP-0187968-A2 | Adhesion characterization test site | International Business Machines Corporation (US) | 1986-07-23 | — | — | EP | claimed |