SCHEMBL2795403

SCHEMBL2795403

C[CH]COCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2919638 0.82
SCHEMBL159509 0.82
SCHEMBL998785 0.81
SCHEMBL1490578 0.80 ALDH1A1 (0.67)
SCHEMBL19886228 0.80 ALDH1A1 (0.67)
SCHEMBL5655527 0.80 ALDH1A1 (0.67)
SCHEMBL8685711 0.79 ALDH1A1 (0.84)
Propene SCHEMBL26630 0.78 ALDH1A1 (0.64)
Propene SCHEMBL2776876 0.78 ALDH1A1 (0.64)
Propene SCHEMBL2778270 0.78 ALDH1A1 (0.64)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111247609-B Conductive polymer dispersions for improved reliability 凯米特电子公司 2022-09-27 CN claimed
CN-111247609-A Conductive polymer dispersions for improved reliability 凯米特电子公司 2020-06-05 CN claimed
US-10658121-B2 Process for forming a solid electrolytic capacitor KEMET ELECTRONICS CORPORATION (US) 2020-05-19 US claimed
US-10650980-B2 Conductive polymer dispersion for improved reliability KEMET ELECTRONICS CORPORATION (US) 2020-05-12 US claimed
US-20190115159-A1 Conductive Polymer Dispersion for Improved Reliability KEMET ELECTRONICS CORPORATION 2019-04-18 US claimed
US-20190115158-A1 Conductive Polymer Dispersion for Improved Reliability KEMET ELECTRONICS CORPORATION 2019-04-18 US claimed
EP-4397806-A1 ENVIRONMENTALLY FRIENDLY IMPREGNATION SYSTEM FOR FIBER SURFACE TREATMENT, AND PREPARATION METHOD AND IMPREGNATION TREATMENT METHOD THEREFOR Beijing University Of Chemical Technology (CN) 2024-07-10 EP disclosed
US-11992901-B1 Lead-free and halogen-free solder paste DONGGUAN CITY THOUSAND ISLAND METAL FOIL CO., LTD. (CN) 2024-05-28 US disclosed
CN-115505269-B High-heat-conductivity super-soft cushion sheet and preparation method thereof 广东金戈新材料股份有限公司 2024-04-26 CN disclosed
CN-114349910-B Epoxidized styrene-butadiene latex and preparation method and application thereof 河北科技大学 2024-01-09 CN disclosed
WO-2023189618-A1 SURFACE TREATMENT AGENT 日本パーカライジング株式会社 2023-10-05 WO disclosed
US-11676770-B2 Electrolytic capacitor having a higher cap recovery and lower ESR KEMET ELECTRONICS CORPORATION (US) 2023-06-13 US disclosed
CN-116157883-A Conductive polymer dispersion with improved reliability 基美电子公司 2023-05-23 CN disclosed
CN-1079414-C Powder paint composition MITSUI CHEMICALS INC (JP) 2002-02-20 CN disclosed
US-6172028-B1 MIXTURE OF POLYCARBOXYLATE, AMINE AND ACID BASF AKTIENGESELLSCHAFT (DE) 2001-01-09 US disclosed
CN-1210548-A Polyether copolymer and solid polymer electrolyte DAISO CO LTD (JP) 1999-03-10 CN disclosed
EP-0400999-B1 Polyurethane-polyurea particles and process for production thereof DAINIPPON INK & CHEMICALS (JP) 1996-04-03 EP disclosed
US-5248789-A Epoxy silicone PPG INDUSTRIES, INC. (US) 1993-09-28 US disclosed
US-5155165-A Three dimensional, crosslinked, pigmented; interfacial polymerization of diisocyanates, polyester polyols, polyamines , polylactones, polycarbonate polyols; fully formed shells and cores; for paints, printing inks DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-10-13 US disclosed
EP-0400999-A2 Polyurethane-polyurea particles and process for production thereof DAINIPPON INK AND CHEMICALS, INC. (JP) 1990-12-05 EP disclosed