SCHEMBL28003191

SCHEMBL28003191

C=C(CC(C)S(=O)(=O)O)C(=O)OC

nearest known ligand 0.37

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.37
TGFBR1 P36897 1/20 0.32
CA14 Q9ULX7 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28027888 0.78 ALDH1A1 (0.41) ALDH1A1TGFBR1TSHR
SCHEMBL2472079 0.78 GRIK1 (0.48)
SCHEMBL4887464 0.77 ALDH1A1 (0.44) ALDH1A1TGFBR1TSHR
SCHEMBL27173492 0.76 GRIK1 (0.47)
SCHEMBL1995868 0.76 GRIK1 (0.33)
SCHEMBL6891698 0.75 ALDH1A1 (0.42) ALDH1A1TGFBR1TSHR
SCHEMBL11052506 0.74 ALDH1A1 (0.41) ALDH1A1TGFBR1TSHR
SCHEMBL26521957 0.74 ALDH1A1 (0.41) ALDH1A1TGFBR1TSHR
SCHEMBL28703822 0.73 ALDH1A1 (0.44) ALDH1A1TGFBR1TSHR
Benzene SCHEMBL28105172 0.72 ALDH1A1 (0.39) ALDH1A1TGFBR1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104583455-B Forming method, fine metal pattern and the electronic component of fine metal pattern DIC株式会社 2018-05-25 CN disclosed
CN-104936774-B Layered product, conductive pattern, the manufacture method of circuit and layered product DIC株式会社 2017-11-14 CN disclosed
CN-105026140-B The manufacture method of layered product, conductive pattern and layered product DIC株式会社 2017-09-26 CN disclosed
CN-105026140-A Laminate, conductive pattern, and laminate production method DAINIPPON INK &AMP 2015-11-04 CN disclosed
CN-104936774-A Laminate, conductive pattern, electrical circuit, and method for producing laminate DAINIPPON INK & CHEMICALS 2015-09-23 CN disclosed
CN-103201117-B Resin composition for forming receiving layer, and receiving substrate, printed matter, conductive pattern and circuit obtained using same DIC CORP. (JP) 2015-08-19 CN disclosed
CN-104583455-A Ultrafine metal pattern forming method, ultrafine metal patterns, and electronic components DAINIPPON INK & CHEMICALS 2015-04-29 CN disclosed