SCHEMBL2802260

SCHEMBL2802260

CO[SiH2]OC.[H+].[H+]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27973088 1.00
SCHEMBL8619869 0.94
SCHEMBL22634 0.94
Methane SCHEMBL525613 0.89
SCHEMBL5961103 0.89
Hydrochloric Acid SCHEMBL23581440 0.89
Hydrochloric Acid SCHEMBL7630001 0.89
Bromide SCHEMBL10572728 0.89
SCHEMBL28105127 0.89
Ethylene SCHEMBL11423042 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8440775-B2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device DOW CORNING CORPORATION (US) 2013-05-14 US claimed
US-20100089451-A1 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device DOW CORNING TORAY COMPANY, LTD. (JP) 2010-04-15 US claimed
EP-2118175-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2009-11-18 EP claimed
WO-2008099767-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2008-08-21 WO claimed
US-8440775-B2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device DOW CORNING CORPORATION (US) 2013-05-14 US disclosed
US-20100089451-A1 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device DOW CORNING TORAY COMPANY, LTD. (JP) 2010-04-15 US disclosed
EP-2118175-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2009-11-18 EP disclosed
WO-2008099767-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2008-08-21 WO disclosed