SCHEMBL28025389

SCHEMBL28025389

C=C[n+]1ccn(CC)c1.F[P-](F)(F)(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5718742 0.92 — —
Bromide SCHEMBL2947343 0.90 FDPS (0.32) —
Iodide SCHEMBL6853621 0.90 FDPS (0.32) —
Hydrochloric Acid SCHEMBL5518177 0.90 FDPS (0.32) —
SCHEMBL15052311 0.89 — —
SCHEMBL28665176 0.86 MEN1 (0.34) —
Thiocyanic Acid SCHEMBL28760135 0.84 — —
SCHEMBL28873569 0.83 MEN1 (0.42) —
SCHEMBL28760035 0.82 FDPS (0.34) —
Sulfuric Acid SCHEMBL7997219 0.82 FDPS (0.34) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115867586-A Electrochemically debondable adhesive compositions 汉高股份有限及两合公司 2023-03-28 — — CN claimed
WO-2024005716-A1 COMPOSITE MATERIALS NANYANG TECHNOLOGICAL UNIVERSITY (SG) 2024-01-04 — — WO disclosed
CN-115867586-A Electrochemically debondable adhesive compositions 汉高股份有限及两合公司 2023-03-28 — — CN disclosed
CN-112086564-A Passivating agent and passivation method thereof and method for preparing semiconductor film 杭州纤纳光电科技有限公司 2020-12-15 — — CN disclosed
CN-111435705-A Repairing agent and repairing method thereof and method for preparing photoelectric film 杭州纤纳光电科技有限公司 2020-07-21 — — CN disclosed
CN-102666665-B Silicone compositions comprising a swollen silicone gel DOW CORNING 2015-07-22 — — CN disclosed
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