SCHEMBL2802853

SCHEMBL2802853

O=C(O)C=CCC=Cc1ccccc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 2/20 0.68
HDAC4 P56524 2/20 0.68
HDAC1 Q13547 2/20 0.68
HDAC2 Q92769 2/20 0.68
HDAC8 Q9BY41 2/20 0.68
HDAC6 Q9UBN7 2/20 0.68
HCAR2 Q8TDS4 2/20 0.68
TNKS O95271 1/20 0.68
HDAC7 Q8WUI4 1/20 0.68
HDAC10 Q969S8 1/20 0.68
HDAC11 Q96DB2 1/20 0.68
TNKS2 Q9H2K2 1/20 0.68
HDAC9 Q9UKV0 1/20 0.68
HDAC5 Q9UQL6 1/20 0.68
PAM P19021 1/20 0.61
PTGER4 P35408 1/20 0.59
PTGER3 P43115 1/20 0.59
PTGER2 P43116 1/20 0.59
LMNA P02545 3/20 0.56
PLIN1 O60240 2/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9437998 1.00 HDAC3 (0.68) HDAC3HDAC4HDAC1HDAC2HDAC8
SCHEMBL10454350 0.88 HDAC3 (0.63) HDAC3HDAC4HDAC1HDAC2HDAC8
SCHEMBL13105277 0.88 HAO1 (0.61) HDAC3HDAC4HDAC1HDAC2HDAC8
Fumaric Acid SCHEMBL8006609 0.84 HDAC3 (0.59) HDAC3HDAC4HDAC1HDAC2HDAC8
SCHEMBL9777486 0.83 IDO1 (0.58) PAMLMNAALDH1A1TDP1MAOB
SCHEMBL4863423 0.83 IDO1 (0.58) PAMLMNAALDH1A1TDP1MAOB
SCHEMBL7264356 0.83 PAM (0.56) HDAC3HDAC4HDAC1HDAC2HDAC8
SCHEMBL11315341 0.83 HDAC1 (0.57) HDAC3HDAC4HDAC1HDAC2HDAC8
Cinnamic Acid SCHEMBL653827 0.81 HCAR2 (1.00) HDAC3HDAC4HDAC1HDAC2HDAC8
Cinnamic Acid SCHEMBL1706935 0.81 HCAR2 (1.00) HDAC3HDAC4HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024135649-A1 ADHESIVE SHEET AND METHOD FOR PRODUCING ADHESIVE SHEET 積水化学工業株式会社 2024-06-27 WO disclosed
CN-110462715-B Heat-shrinkable label, package, and method for producing heat-shrinkable label 东洋纺株式会社 2024-05-28 CN disclosed
CN-117957291-A Aqueous surface treatment composition 迈图高新材料公司 2024-04-30 CN disclosed
CN-117255840-A Pressure-sensitive adhesive sheet, laminate, and device for transmitting or receiving electromagnetic waves 积水化学工业株式会社 2023-12-19 CN disclosed
CN-116461233-A Method for producing recorded matter and method for packaging package 精工爱普生株式会社 2023-07-21 CN disclosed
WO-2023048013-A1 ADHESIVE SHEET, LAMINATE, AND DEVICE FOR TRANSMITTING OR RECEIVING ELECTROMAGNETIC WAVES 積水化学工業株式会社 2023-03-30 WO disclosed
US-20210230336-A1 BLOCK COPOLYMER COMPOSITION INCLUDING IONIC GROUP, AND FILM ZEON CORPORATION (JP) 2021-07-29 US disclosed
CN-112154160-A Modified hydrogenated product, process for producing the same, resin composition, and various uses thereof 株式会社可乐丽 2020-12-29 CN disclosed
WO-2020235664-A1 HYDROGENATED PRODUCT-CONTAINING COMPOSITION, RESIN COMPOSITION, AND VARIOUS APPLICATIONS THEREFOR 株式会社クラレ (JP) 2020-11-26 WO disclosed
WO-2020235663-A1 HYDROGENATED BLOCK COPOLYMER, RESIN COMPOSITION, AND THEIR VARIOUS APPLICATIONS 株式会社クラレ (JP) 2020-11-26 WO disclosed
EP-2078047-A2 POLYURETHANE ADHESIVE Lucite International, Inc. (US) 2009-07-15 EP disclosed
WO-2008057381-A2 POLYURETHANE ADHESIVE LUCITE INTERNATIONAL, INC. (US) 2008-05-15 WO disclosed
US-20080090036-A1 Heat-Shrinkable Laminate Film, and Molded Product and Container Using the Film MITSUBISHI PLASTICS, INC. (JP) 2008-04-17 US disclosed
US-20080026170-A1 Heat-Shrinkable Laminate Film, Molded Product and Heat Shrinkable Label Employing the Film, and Container MITSUBISHI PLASTICS, INC. (JP) 2008-01-31 US disclosed
EP-1752285-A1 HEAT SHRINK LAMINATE FILM, MOLDING UTILIZING THE FILM, HEAT SHRINK LABEL AND CONTAINER MITSUBISHI PLASTICS INC. (JP) 2007-02-14 EP disclosed
US-7166342-B2 Thermoplastic resin film and process for producing the same TOYO BOSEKI KABUSHIKI KAISHA (JP) 2007-01-23 US disclosed
US-7022462-B1 Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern, and process for producing printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-04-04 US disclosed
US-20050095379-A1 Thermoplastic resin film and process for producing the same TOYO BOSEKI KABUSHIKI KAISHA (JP) 2005-05-05 US disclosed
EP-1460101-A1 THERMOPLASTIC RESIN FILM AND PROCESS FOR PRODUCING THE SAME Toyo Boseki Kabushiki Kaisha (JP) 2004-09-22 EP disclosed
EP-1174767-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, PROCESS FOR PRODUCING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-01-23 EP disclosed