SCHEMBL2803905

SCHEMBL2803905

FOOC(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5479316 0.75
SCHEMBL1945972 0.75 TSHR (0.33)
SCHEMBL2464434 0.70
SCHEMBL14331176 0.67
SCHEMBL3822523 0.67
SCHEMBL9770213 0.66
SCHEMBL465096 0.64
SCHEMBL17729851 0.61
SCHEMBL7561377 0.61
SCHEMBL2805763 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100320428-A1 GASEOUS DIELECTRICS WITH LOW GLOBAL WARMING POTENTIALS HONEYWELL INTERNATIONAL INC. (US) 2010-12-23 US claimed
US-20080135817-A1 Gaseous dielectrics with low global warming potentials HONEYWELL INTERNATIONAL INC. 2008-06-12 US claimed
US-20070224829-A1 Use Of Hypofluorites, Fluoroperoxides, And/Or Fluorotrioxides As Oxidizing Agent In Fluorocarbon Etch Plasmas AIR PRODUCTS AND CHEMICALS, INC. (US) 2007-09-27 US claimed
CN-1599038-A Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas AIR PROD & CHEM (US) 2005-03-23 CN claimed
US-20050014383-A1 Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas VERSUM MATERIALS US, LLC 2005-01-20 US claimed
EP-1498940-A2 Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-01-19 EP claimed
US-20130000764-A1 MULTI-LAYER MICRO/NANOFLUID DEVICES WITH BIO-NANOVALVES UCHICAGO ARGONNE, LLC (US) 2013-01-03 US disclosed
US-8343425-B1 Multi-layer micro/nanofluid devices with bio-nanovalves UCHICAGO ARGONNE, LLC (US) 2013-01-01 US disclosed
US-20100320428-A1 GASEOUS DIELECTRICS WITH LOW GLOBAL WARMING POTENTIALS HONEYWELL INTERNATIONAL INC. (US) 2010-12-23 US disclosed
US-7807074-B2 Gaseous dielectrics with low global warming potentials HONEYWELL INTERNATIONAL INC. (US) 2010-10-05 US disclosed
US-20080135817-A1 Gaseous dielectrics with low global warming potentials HONEYWELL INTERNATIONAL INC. 2008-06-12 US disclosed
US-20070224829-A1 Use Of Hypofluorites, Fluoroperoxides, And/Or Fluorotrioxides As Oxidizing Agent In Fluorocarbon Etch Plasmas AIR PRODUCTS AND CHEMICALS, INC. (US) 2007-09-27 US disclosed
CN-1599038-A Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas AIR PROD & CHEM (US) 2005-03-23 CN disclosed
US-20050014383-A1 Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas VERSUM MATERIALS US, LLC 2005-01-20 US disclosed
EP-1498940-A2 Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-01-19 EP disclosed