SCHEMBL2804332

SCHEMBL2804332

CCO[Si](OCC)(OCC)[C@@H](CC)NC(=O)NCCc1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ KMT2A Q03164 3/20 0.56
▸ MEN1 O00255 1/20 0.56
▸ TSHR P16473 1/20 0.56
▸ EPHX2 P34913 6/20 0.52
▸ ANPEP P15144 1/20 0.49
▸ POLB P06746 1/20 0.48
▸ NPC1 O15118 2/20 0.48
▸ MAPT P10636 2/20 0.48
▸ RAB9A P51151 2/20 0.48
▸ EPHX1 P07099 2/20 0.48
▸ SMN1; SMN2 Q16637 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8517206 1.00 KMT2A (0.56) KMT2AMEN1TSHREPHX2ANPEP
SCHEMBL2809207 1.00 KMT2A (0.56) KMT2AMEN1TSHREPHX2ANPEP
SCHEMBL10428978 0.88 KMT2A (0.57) KMT2AMEN1TSHREPHX2ANPEP
SCHEMBL28423022 0.79 HSD17B10 (0.48) KMT2AMEN1TSHREPHX2NPC1
SCHEMBL28837431 0.77 KMT2A (0.55) KMT2AMEN1TSHRPOLBNPC1
SCHEMBL810960 0.76 MEN1 (0.51) KMT2AMEN1EPHX2POLBMAPT
SCHEMBL4561830 0.75 ALDH1A1 (0.32) —
SCHEMBL485762 0.75 EPHX1 (0.55) KMT2AMEN1TSHREPHX2NPC1
SCHEMBL28837423 0.74 EPHX1 (0.54) KMT2AMEN1TSHREPHX2NPC1
SCHEMBL6032606 0.72 EPHX1 (0.85) KMT2AMEN1TSHREPHX2NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 — — CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 — — US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 — — US disclosed
US-9956726-B2 Apparatus for producing three-dimensional structure, method of producing three-dimensional structure, and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2018-05-01 — — US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 — — US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 — — US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 — — US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 — — US disclosed
US-9393740-B2 Method of producing three-dimensional structure, apparatus for producing three-dimensional structure, and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2016-07-19 — — US disclosed
US-20160107385-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2016-04-21 — — US disclosed
EP-2168757-B1 METHOD OF MANUFACTURING A PLASTIC LENS HOYA CORP (JP) 2015-04-29 — — EP disclosed
US-8322033-B2 Method for forming a conductive post for a multilayered wiring substrate SEIKO EPSON CORPORATION (JP) 2012-12-04 — — US disclosed
US-20100239776-A1 METHOD FOR PRODUCING PLASTIC LENS HOYA CORPORATION (JP) 2010-09-23 — — US disclosed
EP-2168757-A1 METHOD FOR PRODUCING PLASTIC LENS Hoya Corporation (JP) 2010-03-31 — — EP disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 — — US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 — — US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 — — US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 — — US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 — — US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 — — US disclosed
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