SCHEMBL28047980

SCHEMBL28047980

C[SiH](OCC1CO1)O[Si](C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.39
TSHR P16473 4/20 0.36
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.35
TDP1 Q9NUW8 2/20 0.33
GLA P06280 1/20 0.32
TP53 P04637 2/20 0.30
MAPT P10636 2/20 0.30
HPGD P15428 2/20 0.30
MEN1 O00255 1/20 0.30
CYP1A2 P05177 1/20 0.30
KMT2A Q03164 1/20 0.30
PPARG P37231 1/20 0.30
HIF1A Q16665 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5084658 0.77
SCHEMBL2672371 0.75
SCHEMBL7919984 0.73 SMN1; SMN2 (0.39) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL6123483 0.70 TSHR (0.41) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL18406283 0.69
SCHEMBL28044162 0.69 TSHR (0.48) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL8601512 0.67 TSHR (0.56) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL812694 0.67
SCHEMBL26676511 0.67
SCHEMBL2883602 0.67 TSHR (0.55) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105223777-A A kind of stereolithography rapid prototyping mixes type polysiloxane group photosensitive resin composition and its preparation method and application UNIV QINGDAO SCIENCE & TECHNOLOGY 2016-01-06 CN claimed
CN-113881377-A Anhydride-curable organic silicon modified epoxy resin pouring sealant and preparation method thereof 东莞市雄驰电子有限公司 2022-01-04 CN disclosed
CN-113789143-A Room-temperature curable organic silicon modified epoxy resin pouring sealant and preparation method thereof 东莞市雄驰电子有限公司 2021-12-14 CN disclosed
CN-108912299-B Calendering-grade high-temperature-resistant thermoplastic polyurethane elastomer and preparation method thereof 浙江华峰热塑性聚氨酯有限公司 2021-01-05 CN disclosed