Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 6/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.36 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.36 |
| ▸ | ACACB | O00763 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | TGM2 | P21980 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8436115 | 0.79 | — | — | |
| SCHEMBL27425077 | 0.76 | TSHR (0.35) | TSHRALDH1A1MAPK1TDP1ZDHHC20 | |
| Hydrochloric Acid SCHEMBL27389927 | 0.74 | TSHR (0.34) | TSHRALDH1A1MAPK1TDP1ZDHHC20 | |
| Water SCHEMBL27635915 | 0.74 | TSHR (0.34) | TSHRALDH1A1MAPK1TDP1ZDHHC20 | |
| SCHEMBL19821897 | 0.74 | — | — | |
| SCHEMBL27688486 | 0.74 | — | — | |
| SCHEMBL27844786 | 0.73 | TSHR (0.45) | TSHRALDH1A1MAPK1TDP1TGM2 | |
| SCHEMBL8794243 | 0.73 | TSHR (0.43) | TSHRALDH1A1MAPK1TDP1ZDHHC20 | |
| Chloromethane SCHEMBL27466989 | 0.73 | TSHR (0.33) | TSHRALDH1A1MAPK1TDP1ZDHHC20 | |
| SCHEMBL1756828 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108713242-A | The grinding method and composition for polishing set group of silicon substrate | 福吉米株式会社 | 2018-10-26 | — | — | CN | disclosed |
| CN-105264647-B | Silicon Wafer composition for polishing | 福吉米株式会社 | 2018-01-09 | — | — | CN | disclosed |
| CN-106011803-A | Two-layer flexible copper-clad laminate substrate and process for producing same | 株式会社杰希优 | 2016-10-12 | — | — | CN | disclosed |
| CN-105264647-A | Composition for silicon wafer polishing | FUJIMI INC | 2016-01-20 | — | — | CN | disclosed |