Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.48 |
| ▸ | CALM1 | P0DP23 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.42 |
| ▸ | TSHR | P16473 | 3/20 | 0.42 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.42 |
| ▸ | CES2 | O00748 | 1/20 | 0.42 |
| ▸ | CES1 | P23141 | 1/20 | 0.42 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.42 |
| ▸ | CA12 | O43570 | 1/20 | 0.41 |
| ▸ | CA9 | Q16790 | 1/20 | 0.41 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.41 |
| ▸ | IDO1 | P14902 | 1/20 | 0.41 |
| ▸ | LOXL2 | Q9Y4K0 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzene SCHEMBL28114321 | 0.91 | CALM1 (0.53) | TP53CALM1ALDH1A1TSHREPHX2 | |
| SCHEMBL28 | 0.91 | — | — | |
| Chloromethane SCHEMBL28259920 | 0.88 | TP53 (0.48) | TP53CALM1ALDH1A1TSHRTRPA1 | |
| SCHEMBL27769510 | 0.88 | — | — | |
| SCHEMBL9517116 | 0.88 | — | — | |
| SCHEMBL28997420 | 0.88 | — | — | |
| SCHEMBL29270152 | 0.88 | — | — | |
| SCHEMBL21680909 | 0.88 | — | — | |
| SCHEMBL27686006 | 0.88 | — | — | |
| SCHEMBL28202766 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109971122-A | Epoxy resin molding material for encapsulation and electronic part apparatus | 日立化成株式会社 | 2019-07-05 | — | — | CN | disclosed |
| CN-107076888-A | Light reflection film, method for producing light reflection film, method for decorative molding of light reflection film, laminated glass, and curved body | 柯尼卡美能达株式会社 | 2017-08-18 | — | — | CN | disclosed |
| CN-106085316-A | Encapsulating epoxy resin composition and electronic part apparatus | 日立化成工业株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-102585438-B | Epoxy resin composition for sealing and electronic component device | 日立化成工业株式会社 | 2016-07-06 | — | — | CN | disclosed |
| CN-103221452-B | Encapsulating epoxy resin moulding material and there is the electronic part apparatus of the element sealed with this moulding material | 日立化成株式会社 | 2016-06-22 | — | — | CN | disclosed |