Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.64 |
| ▸ | MEN1 | O00255 | 2/20 | 0.64 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.64 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.57 |
| ▸ | MAPT | P10636 | 3/20 | 0.57 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.57 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.57 |
| ▸ | USP2 | O75604 | 1/20 | 0.57 |
| ▸ | LMNA | P02545 | 1/20 | 0.57 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.57 |
| ▸ | GAA | P10253 | 1/20 | 0.57 |
| ▸ | HPGD | P15428 | 1/20 | 0.57 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.57 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.57 |
| ▸ | HTT | P42858 | 1/20 | 0.57 |
| ▸ | IKBKB | O14920 | 1/20 | 0.50 |
| ▸ | MAOA | P21397 | 1/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.48 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.48 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL653071 | 0.93 | TDP1 (0.74) | TDP1MEN1KMT2AHSD17B10MAPT | |
| SCHEMBL30392415 | 0.93 | TDP1 (0.74) | TDP1MEN1KMT2AHSD17B10MAPT | |
| SCHEMBL27829121 | 0.93 | TDP1 (0.74) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Water SCHEMBL3120549 | 0.91 | TDP1 (0.70) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Methane SCHEMBL27562098 | 0.91 | MEN1 (0.70) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Formaldehyde SCHEMBL27638408 | 0.86 | KMT2A (0.64) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Sulfur Dioxide SCHEMBL29028945 | 0.84 | KMT2A (0.61) | TDP1MEN1KMT2AHSD17B10MAPT | |
| SCHEMBL12772920 | 0.83 | TDP1 (0.93) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Ether SCHEMBL3120545 | 0.82 | MEN1 (0.52) | TDP1MEN1KMT2AHSD17B10MAPT | |
| Hydrochloric Acid SCHEMBL1646515 | 0.80 | TDP1 (0.88) | TDP1MEN1KMT2AHSD17B10MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105601922-B | Polyamic acid for two layers of flexible glue-free copper coated plate of method production and preparation method thereof | 深圳市弘海电子材料技术有限公司 | 2018-05-22 | — | — | CN | claimed |
| CN-115863528-A | Negative electrode slurry for secondary battery and preparation method thereof | 桂林电器科学研究院有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-115692709-A | Negative electrode slurry for lithium ion battery and preparation method thereof | 桂林电器科学研究院有限公司 | 2023-02-03 | — | — | CN | disclosed |
| CN-111073008-B | Low-yellowing colorless transparent polyimide film and preparation method thereof | 合肥中汇睿能能源科技有限公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-111073008-A | Low-yellowing colorless transparent polyimide film and preparation method thereof | 合肥中汇睿能能源科技有限公司 | 2020-04-28 | — | — | CN | disclosed |
| CN-111040449-A | Modified polyimide film and preparation method thereof | 合肥中汇睿能能源科技有限公司 | 2020-04-21 | — | — | CN | disclosed |
| CN-110591359-A | Colorless transparent polyimide film | 合肥中汇睿能能源科技有限公司 | 2019-12-20 | — | — | CN | disclosed |
| CN-105665250-B | Two layers of method prepares the flexible production line without glue polyimide copper clad lamination | 深圳市弘海电子材料技术有限公司 | 2018-11-23 | — | — | CN | disclosed |
| CN-105537082-B | Two layers of method prepares drying means of the flexibility without glue polyimide copper clad lamination when | 深圳市弘海电子材料技术有限公司 | 2018-11-09 | — | — | CN | disclosed |
| CN-105598014-B | Two layers of method prepares the flexible amination device without glue polyimide copper clad lamination | 深圳市弘海电子材料技术有限公司 | 2018-11-09 | — | — | CN | disclosed |
| CN-105601922-B | Polyamic acid for two layers of flexible glue-free copper coated plate of method production and preparation method thereof | 深圳市弘海电子材料技术有限公司 | 2018-05-22 | — | — | CN | disclosed |
| CN-105694034-B | Polyamic acid of flexible glue-free copper coated plate of high-dimensional stability and preparation method thereof | 深圳市弘海电子材料技术有限公司 | 2018-05-22 | — | — | CN | disclosed |
| CN-105644064-B | Two-layer method prepares the flexible method without glue polyimide copper clad lamination | 深圳市弘海电子材料技术有限公司 | 2017-06-20 | — | — | CN | disclosed |
| CN-105694034-A | High-dimensional-stability flexible adhesive-free copper clad plate polyamic acid and preparation method thereof | 深圳市弘海电子材料技术有限公司 | 2016-06-22 | — | — | CN | disclosed |
| CN-105665250-A | Production line for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method | 深圳市弘海电子材料技术有限公司 | 2016-06-15 | — | — | CN | disclosed |
| CN-105669976-A | Amination method for preparing flexible adhesive-free polyimide CCL (copper-clad plate) with two-layer method | 深圳市弘海电子材料技术有限公司 | 2016-06-15 | — | — | CN | disclosed |
| CN-105644064-A | Method for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method | 深圳市弘海电子材料技术有限公司 | 2016-06-08 | — | — | CN | disclosed |
| CN-105598014-A | Amination device for preparing flexible adhesive-free polyimide copper-clad plate by two-layer method | SHENZHEN HONGHAI ELECTRONIC MAT TECH CO LTD | 2016-05-25 | — | — | CN | disclosed |
| CN-105601922-A | Polyamide acid for producing flexible copper plate coated with no rubber through two-layer method and preparing method of polyamide acid | SHENZHEN HONGHAI ELECTRONIC MAT TECH CO LTD | 2016-05-25 | — | — | CN | disclosed |
| CN-105537082-A | Drying method used during preparation of flexible glue-free polyimide copper-clad plate through two-layer method | SHENZHEN HONGHAI ELECTRONIC MAT TECH CO LTD | 2016-05-04 | — | — | CN | disclosed |