SCHEMBL28071259

SCHEMBL28071259

CCO[Si](C)(C)C.[SiH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL38659903 1.00
SCHEMBL27813 0.96
Hydrochloric Acid SCHEMBL27875305 0.92
Dimethylamine SCHEMBL8099499 0.86
SCHEMBL28124175 0.86
SCHEMBL15798544 0.86 ALDH1A1 (0.40)
SCHEMBL1720973 0.86
SCHEMBL5358681 0.86
Alcohol SCHEMBL29072403 0.86 ALDH1A1 (0.40)
SCHEMBL31402845 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112940451-B Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2023-01-31 CN claimed
CN-112940451-A Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2021-06-11 CN claimed
CN-112940451-B Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2023-01-31 CN disclosed
CN-112940451-B Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2023-01-31 CN disclosed
CN-112940451-A Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2021-06-11 CN disclosed
CN-112940451-A Aerogel with melamine foam framework 孚莱孚(上海)新材料有限公司 2021-06-11 CN disclosed
CN-106164713-B Antireflection film, polarizer, cover glass, the manufacture method of image display device and antireflection film 富士胶片株式会社 2018-01-09 CN disclosed
CN-106164713-A The manufacture method of antireflection film, polaroid, cover glass, image display device and antireflection film 富士胶片株式会社 2016-11-23 CN disclosed
CN-103329217-B Conductive fine particles and resin particles, and anisotropic conductive material using same 株式会社日本触媒 2016-06-29 CN disclosed