⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28290734 | 0.88 | ALDH1A1 (0.35) | — | |
| SCHEMBL22614 | 0.87 | — | — | |
| SCHEMBL28077167 | 0.87 | — | — | |
| Phosphine SCHEMBL28872842 | 0.84 | — | — | |
| Hydrogen Sulfide SCHEMBL3652122 | 0.84 | — | — | |
| Ethylene SCHEMBL4977985 | 0.84 | — | — | |
| SCHEMBL10700503 | 0.84 | — | — | |
| SCHEMBL18575587 | 0.84 | — | — | |
| SCHEMBL843289 | 0.84 | — | — | |
| SCHEMBL438202 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104024126-B | The packing method of granular sealing resin composition, packing material and method for carrying | 住友电木株式会社 | 2016-08-24 | — | — | CN | disclosed |
| CN-102585438-B | Epoxy resin composition for sealing and electronic component device | 日立化成工业株式会社 | 2016-07-06 | — | — | CN | disclosed |