SCHEMBL28087705

SCHEMBL28087705

O=C(O)c1ccc(C(=O)O)c(OC(=O)c2ccccc2C(=O)Oc2cc(C(=O)O)ccc2C(=O)O)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.59
ESR2 Q92731 1/20 0.59
KDM4E B2RXH2 8/20 0.56
HSD17B10 Q99714 6/20 0.56
HPGD P15428 4/20 0.56
ALDH1A1 P00352 4/20 0.56
LMNA P02545 3/20 0.54
CYP1A2 P05177 1/20 0.54
CYP2C9 P11712 1/20 0.54
TSHR P16473 3/20 0.47
CDC25A P30304 1/20 0.47
CDC25B P30305 1/20 0.47
ITGB3 P05106 1/20 0.47
ITGA2B P08514 1/20 0.47
HMGB1 P09429 1/20 0.47
GGT1 P19440 1/20 0.47
PTGS1 P23219 1/20 0.47
PTGS2 P35354 1/20 0.47
BLM P54132 1/20 0.47
NAPRT Q6XQN6 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11285516 0.98 ESR1 (0.58) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL28096375 0.90 ESR1 (0.73) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL11199694 0.88 KDM4E (0.57) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL28489218 0.87 ESR1 (0.65) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL10784196 0.86 ESR1 (0.63) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL10782540 0.85 ESR1 (0.62) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL11278084 0.85 KDM4E (0.54) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL11194444 0.81 KDM4E (0.58) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL11208120 0.81 KDM4E (0.79) ESR1ESR2KDM4EHSD17B10HPGD
SCHEMBL5830313 0.81 ESR1 (0.47) ESR1ESR2KDM4EHSD17B10HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105849216-A Release polyimide film with adhesive layer, laminate with release polyimide film with adhesive layer, laminate, single-layer or multilayer wiring board with release polyimide film with adhesive layer, and method for producing multilayer wiring board 日立化成株式会社 2016-08-10 CN disclosed