Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 4/20 | 0.58 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.58 |
| ▸ | CA12 | O43570 | 3/20 | 0.58 |
| ▸ | CA1 | P00915 | 3/20 | 0.58 |
| ▸ | CA9 | Q16790 | 3/20 | 0.58 |
| ▸ | CA3 | P07451 | 2/20 | 0.58 |
| ▸ | CA4 | P22748 | 2/20 | 0.58 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.58 |
| ▸ | GLA | P06280 | 1/20 | 0.58 |
| ▸ | CES2 | O00748 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 4/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | PARP1 | P09874 | 2/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.46 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.46 |
| ▸ | RECQL | P46063 | 1/20 | 0.46 |
| ▸ | BLM | P54132 | 1/20 | 0.46 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenol SCHEMBL1661166 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28184478 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28138375 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL160625 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL27834583 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL27699920 | 0.97 | CA2 (0.61) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28079933 | 0.95 | CA2 (0.58) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28113269 | 0.95 | CA2 (0.58) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28262934 | 0.95 | CA2 (0.58) | CA2TDP1CA12CA1CA9 | |
| Phenol SCHEMBL28091470 | 0.95 | CA2 (0.58) | CA2TDP1CA12CA1CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107353646-A | Heat-resistant heat-preservation composite material and preparation method thereof | 嘉兴立新材料有限公司 | 2017-11-17 | — | — | CN | claimed |
| CN-110139893-A | Prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2019-08-16 | — | — | CN | disclosed |
| CN-110121531-A | Resin composition for printed circuit board, prepreg, resin sheet, plywood, clad with metal foil plywood, printed circuit board and multilayer board | 三菱瓦斯化学株式会社 | 2019-08-13 | — | — | CN | disclosed |
| CN-110121530-A | Resin combination, prepreg, plywood, clad with metal foil plywood, printed circuit board and multilayer board | 三菱瓦斯化学株式会社 | 2019-08-13 | — | — | CN | disclosed |
| CN-110114407-A | Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2019-08-09 | — | — | CN | disclosed |
| CN-109988288-A | Prepreg, metal foil laminated board and printed circuit board obtained by resin combination and use the composition | 台燿科技股份有限公司 | 2019-07-09 | — | — | CN | disclosed |
| CN-108431133-B | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2019-06-14 | — | — | CN | disclosed |
| CN-106366128-B | Phosphaphenanthrene compound and preparation method and application thereof | 中山台光电子材料有限公司 | 2019-05-07 | — | — | CN | disclosed |
| CN-108779330-A | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2018-11-09 | — | — | CN | disclosed |
| CN-108431133-A | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2018-08-21 | — | — | CN | disclosed |
| CN-105086351-B | A kind of hot melt phenolic resin preimpregnation material and preparation method thereof | 西安交通大学 | 2018-07-17 | — | — | CN | disclosed |
| CN-105694451-B | A kind of halogen-free resin composition, prepreg, laminate and circuit board | 浙江华正新材料股份有限公司 | 2018-04-13 | — | — | CN | disclosed |
| CN-103102471-B | Phosphorus containing phenolic resin and its manufacture method, the resin combination, solidfied material | 新日铁住金化学株式会社 | 2018-01-09 | — | — | CN | disclosed |
| CN-107353646-A | Heat-resistant heat-preservation composite material and preparation method thereof | 嘉兴立新材料有限公司 | 2017-11-17 | — | — | CN | disclosed |
| CN-104628996-B | Flame retardant with Bisphenol F base, fire-retarded epoxy resin and flame-retardant composition | 广东广山新材料有限公司 | 2017-03-01 | — | — | CN | disclosed |
| CN-104628997-B | Flame retardant with bisphenol S base, fire-retarded epoxy resin and flame-retardant composition | 广东广山新材料有限公司 | 2017-03-01 | — | — | CN | disclosed |
| CN-104401073-B | A kind of preparation method of halogen-free flame-proof phenolic laminated paper board | 北京新福润达绝缘材料有限责任公司 | 2016-08-31 | — | — | CN | disclosed |